Virtium Announces its New 8GB DDR3 VLP Registered DIMM Using 2Gbit Non-Stack Components

New 8GB VLP Registered DIMM module exceeds high density, low cost requirements for space-constrained embedded and telecom applications.

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Rancho Santa Margarita, CA (Vocus/PRWEB) January 26, 2011

Virtium Technology Inc., a leading designer and manufacturer of long-life memory modules for mission-critical applications, today announced its new 8 gigabyte (GB) DDR3 Registered DIMM in the Very-Low Profile (VLP). Virtium’s new 8GB VLP Registered DIMM module has a height of only 18.3mm (0.72 inches) and measures a minimal 3.57mm (0.140 inches) thick. It has been innovatively designed using mainstream 2Gbit DDR3 DRAM monolithic package non-stacked components that meet a broad range of high density, smaller size and lower cost memory application requirements. Using Virtium’s breakthrough layout technique, customers realize increased reliability and the design advantages of a greatly reduced module thickness that enables increased airflow through the components and throughout the system. The Virtium 8GB VLP Registered DIMM is an excellent solution for current and next-generation embedded OEM and telecommunications applications such as storage blade servers, AdvancedTCA blades, Ethernet switches and routers.

“Our new 8GB VLP Registered DIMM products deliver the most optimized high density and cost-efficient module solution compared to competitive dual die package (DDP) DRAM products,” said Phan Hoang, vice president of research and development at Virtium Technology. “Because of Virtium’s monolithic non-stack design that incorporates mainstream DDR3 DRAM, our OEM customers also benefit from shorter production lead-times versus using other DDP-based modules.”

Part Number    Product Description                
VL33B1K60E-K9S    8GB VLP registered DIMM 1.5V PC3-10600 CL9
VL33B1K60E-F8S    8GB VLP registered DIMM 1.5V PC3-8500 CL7

Product samples of the Virtium 8GB DDR3 VLP Registered DIMM are available now and full production is slated for February, 2011. The new modules will be available with thermal heat-spreader, thermal sensor, conformal coating and underfill protection options.

ABOUT VIRTIUM
Since 1997, Virtium memory solutions have been integrated by leading computer manufacturers around the globe, in a wide variety of challenging industries where performance and reliability are paramount, including embedded systems, networking/telecom, storage servers, military/aerospace, medical, and infotainment markets. Virtium combines first to market memory solutions with continuity of support for legacy memory products in mature systems. Virtium provides extra-mile service to save design engineers and procurement professionals’ time and money. Virtium delivers a worry-free experience.

Its memory module product line encompasses a wide range of densities and data transfer rates in all major memory product categories including DDR3 and DDR2 MiniDIMM, VLP MiniDIMM, VLP Unbuffered Mini-DIMM, VLP Registered Mini-DIMM, SO-UDIMM, SO-RDIMM, ECC SODIMM, Mini-UDIMM and Mini-RDIMM, together with enhancements needed in challenging environments.

Headquartered in Southern California, Virtium is a privately held; financially-sound technology company with U.S.-based design and manufacturing facilities certified to IS0 9001:2000 and AS9100 Rev. B. Virtium maintains representative offices throughout the U.S., Europe and Asia. For more information, call toll-free at 1-888-VIRTIUM (1-888-847-8486) or visit Virtium Technology online at http://www.virtium.com.

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  • Annette Keller
    Keller Communication
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