SPS Wins a Sesame with Embedded Contactless Module

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Smart Packaging Solutions is proud to announce its innovation capability has been recognized again with a new Sesame award for its Embedded Contactless Module technology.

SPS Embedded Contactless Module

“This Sesame award brings SPS the recognition of the secure transaction industry. We receive it as an acknowledgement of our technology excellence built over years of R & D and experience in manufacturing processes” said Michael ZAFRANY, COO, SPS.

Smart Packaging Solutions, has received a Sesame award recognizing the innovation excellence demonstrated by the company’s Embedded Contactless Module technology.

Announced during Cartes & IDentification trade show in Paris, Sesame awards reward the most innovative technologies in the digital security and smart technologies industry.

This year 317 applications have been filed for 10 awards. SPS has first been selected as a finalist in the “Identification / ID cards” category, and has then triumphed from other finalists to obtain the award, demonstrating the company expertise and the recognition of the industry community.

SPS is recognized with a Sesame for the second time in its history. In 2006, the company already received a Sesame for its ePastille technology.

The awarded technology, “SPS Embedded Contactless Module”, consists in separating the module from the antenna in a contactless card. This way, the antenna is integrated with the plastic card according to a standard contactless card manufacturing process, and then, the module is added according to a standard contact card manufacturing process.

Entirely based on standard manufacturing processes, SPS “Embedded Contactless Module” technology brings sizeable cost savings to smart card and secure document manufacturers. In addition, as the process is stable and reliable, higher yields are achieved, and final products demonstrate a higher reliability over time.

“This Sesame award brings SPS technology the recognition of the secure transaction industry community. We receive it as an acknowledgement of our technology excellence built over years of R&D and experience in manufacturing processes”, said Michael ZAFRANY, COO of SPS.

Smart Packaging Solutions is present at Cartes & IDentification trade show, until November 17th, on booth 4 K 098.

About SPS
With more than 20 years of experience in the field of smart card technologies, Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e- passport and dual interface banking cards. Headquartered in Rousset, France, SPS employs 80 people. The company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at http://www.s-p-s.com

Contact
Philippe LAURI, sales director, SPS, contact(at)s-p-s(dot)com, tel: +33 4 42 53 84 40

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Philippe LAURI
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