SelectConnect Technologies Announces Surface Activation Method and Ionic Plating Line for Metallizing Hard to Plate Plastics Without the Need for Chromic Acid

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SelectConnect Technologies announces Surface Activation Method and Ionic Palladium Line for metallizing hard to plate plastics without the need for chromic acid or mechanical etching. The process conforms to MTL-DTL-38999 specifications for Automotive, Medical, Military and Aerospace Applications

The process yields a nice uniform, smooth finish with better adhesion than currently accepted methods

SelectConnect Technologies announces Surface Activation Method and Ionic Palladium Plating Line for metallizing hard to plate plastics without the need for chromic acid or mechanical etching. The process conforms to MTL-DTL-38999 specifications for Automotive, Medical, Military and Aerospace Applications

SelectConect utilizes a sulfonation process to prepare the surfaces for plating. Sulfonation prepares the surface for plating without the use of chromic acid or mechanical etching. According to Frank Wagner, Manageing Director ASF Central at MacDermid Industial Solutions, " The process yields a nice uniform, smooth finish with better adhesion than currently accepted methods".

The process allows for plating on Ultem ® (Polyetherimide), PEEK (polyether ether ketone ), Nylon (polyamide) and Acetal. These non-mettalic compounds are impossible to plate otherwise.

The benefits of plating on the above materials are:

  •     More Strength (glass/carbon reinforced)
  •     High Temperature Capacity
  •     Lower Weight (approximately 50% less than aluminum)

The main characteristics of sulfonated parts vs. chemically etched or mechanically abraded parts are:

  •     High adhesion values
  •     Smooth surfaces which retain the substrate profiles
  •     RoHS compliant

SelectConnect Technologies is proud to be one of the only companies in North America with the capabilitiy to offer the Surface Activation Method and Ionic Palladium Plating of plastics to meet MTL-DTL-38999.

About SelectConnect Technologies

SelectConnect Technologies manufactures 3-dimensional molded interconnects using the LPKF-LDS process to laser scribe circuitry on injection molded components, selectively plates circuits integrated into components produced by the Double-Shot molding process and utilize Ionic Palladium plating for plastic parts.

As the only contract provider of LDS 3D-MID services in North America, we work on projects from early phase prototypes scale up to high-volume production. Contact us to learn more about our processes and technologies. We are happy to help.

SelectConnect Technologies is ISO 9001 Certified and ITAR registered. Visit us at SelectConnectTech.com

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Jim Liddle
SelectConnect Technologies
847-359-1490
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