2012 International Interconnect Technology Conference Announces Keynote Speakers

Share Article

Still accepting abstracts for technical sessions until January 16, 2012.

The Program Committee for the 15th Annual IEEE International Interconnect Technology Conference (IITC) and Exhibition is pleased to announce its keynote speakers — Mike Mayberry, VP and Director of Components Research, Intel Corp.; and Billy Dally, VP and Chief Scientist, NVIDIA. IEEE IITC 2012 will be held June 4-6th at the DoubleTree Hotel in San Jose, CA and will be preceded by a day-long Short Course on interconnect technologies on Sunday, June 3rd.

Mike Mayberry will deliver a keynote entitled “What Lies Ahead for Devices and Interconnects?” He is responsible for ongoing research to enable future process options for Intel's technology development organizations. Mayberry joined Intel in 1984 as a process integration engineer and worked on development of EPROM, flash, and logic wafer fab processes. Additionally, he spent several years working on roadmaps and test processes for Intel microprocessors before moving to his current position leading the components research group.

Formerly the chairman of Stanford University’s computer science department, Bill Dally was appointed chief scientist and VP of NVIDIA Research in 2009. Dally and his Stanford team have made seminal contributions to the system architecture, network architecture, signaling, routing and synchronization technology that is found in most large parallel computers today. He will deliver a keynote entitled “Parallel Computing, High Bandwidth Networks and Interconnects”.

Technical Conference Program
The keynotes will kick off a program focused on Materials and Unit Processes, Process Integration, Characterization, Reliability, Chip-Package Interaction (CPI), 3D Integration and TSV Technology, Novel Systems and Packaging, Novel Materials and Concepts, Back-End Memories and MEMS as well as Fine Grain 3D ICs, Contacts and Local Interconnects, Interconnects for Biological Applications, Networks-on-Chip, and Circuits for High-Speed and Low-Power Signaling. Abstracts are currently being accepted, and the deadline for submissions is January 16, 2012. The Call For Papers is available to view here.

In addition to a full conference program, there are also exhibitor and supplier seminars taking place during the conference, making it an excellent venue for sponsor companies looking to reach customers.

The IEEE IITC Conference and Exhibition attracts professionals from industry, academia, and national laboratories in semiconductor processing, interconnect design, and equipment development. Conference topics include both fundamental and applied research, as well as issues related to introduction into manufacturing. The U.S. venue is one of three locations for this premier technology conference, which rotates annually between the U.S., Europe and Asia.

For further details about paper submissions, supplier seminar opportunities or other aspects of the conference, please contact iitc(at)his(dot)com.


Share article on social media or email:

View article via:

Pdf Print

Contact Author


Ruth Brain, IITC Publicity Chair
Visit website