This first of its kind event covering future technologies consists of a series of tutorials on a select set of potentially high-impact emerging technologies, their current state of maturity and scenarios for the future.
Hong Kong (PRWEB) May 26, 2011
IEEE, the world's largest professional association advancing technology for humanity, today announced it is hosting the first IEEE Technology Time Machine (TTM) Symposium. Being held in Hong Kong, 1-3 June 2011, the IEEE TTM is a unique event for industry leaders, academics and decision makers in governments who direct research and development (R&D) activities, plan research programs, or manage portfolios of research activities. Register here:
WHAT: IEEE Technology Time Machine Symposium: This first of its kind event covering future technologies consists of a series of tutorials on a select set of potentially high-impact emerging technologies, their current state of maturity and scenarios for the future. The agenda consists of presentations given by globally recognized experts who are leaders in their field. The Symposium is structured to facilitate discussions among participants and speakers about the evolutionary and revolutionary advances in technology landscapes leading up to 2020.
As the number of participants will be kept relatively small, the IEEE TTM Symposium provides an excellent opportunity for informal interaction among delegates. At the end of the Symposium, there is an opportunity for attendees to visit some leading Hong Kong and Chinese research institutes and industries locally.
WHEN: 1-3 June 2011
WHERE: Sheraton Hotel and Towers, Hong Kong
WHY: Designed for senior business leaders and world-renowned innovators, the IEEE TTM Conference sessions will explore critical innovations and future directions in wireless, biotechnology, cloud computing, e-health, smart grid, Internet of Things, disruptive technologies to replace silicon, etc. Keynote speakers and panelists will help audiences to understand and appreciate how the technology trends are going to impact R&D and business sectors.
WHO: Speakers and sessions for the first IEEE TTM include:
China’s Growing Role in High Tech Industry and Global R&D
Thinking on Transformation of Information Communications Technologies
Prof. Hequan Wu, Academician and former Vice-President of Chinese Academy of Engineering, China
Impact of Technology on Environment
Technology’s contribution to creating an information society friendly to humans and the earth
Mr. Nobuhiro Endo President (Representative Director), NEC, Japan
Internet of Things
CeNSE: A Central Nervous System for the Earth
Dr. Peter Hartwell, Distinguished Technologist, Hewlett-Packard, USA
The Future of Cloud Computing
Mr. Joe Weinman, Worldwide Lead, Communications, Media, and Entertainment Industry Solutions, Hewlett-Packard, USA
The Smart Grid: Power for the 21st Century
Prof. George Arnold, National Coordinator for Smart Grid Interoperability, National Institute of Standards and Technology (NIST), USA
Engineering the 21st Century Healthcare
Prof. Yongmin Kim, Department of Electrical Engineering, University of Washington, USA
Carbon Nanostructures and Conducting Polymers in Electronics
Prof. Henning Sirringhaus, Hitachi Professor of Electron Device Physics, Cavendish Laboratory, University of Cambridge, UK
Future Mobile Services
Thinking on the run
Prof. Hugh Bradlow, Chief Technology Officer, Telstra, Australia
Advances in Biomedical Engineering
How Do We Make Future Neurally Integrated Prosthetic Devices Speak The Same Language as the Nervous System?
Prof. Ralph Etienne Cummings, Department of Electrical and Computer Engineering, John Hopkins University, USA
Digital Content at Home (Displays, Connectivity, Usability, etc)
Future direction of digital contents: What and how will we enjoy at home in 2020?
Prof. Masahiro Fujita, President of System Technologies Laboratories, Sony Corporation, Japan
Energy Harvesting and Storage (batteries, super capacitors)
Environmentally Friendly, Grid Scale Energy Storage
Prof. Micheal Austin, Vice President, BYD America, USA
Future Directions in Wireless
A look into the future
Prof. Jan Färjh, Head of Ericsson research, Sweden
Future of Silicon-based Microelectronics
How Long Will Si Microelectronics Extend: Scaling into 15 nm, 11 nm, and Beyond
Dr. Ghavam Shahidi, IBM Fellow, Director of Silicon Technology, IBM Watson Research Center, USA
World of displays
Prof. Hoi Sing Kwok, Chair Professor, ECE Department, HKUST, Hong Kong
Global R&D Leaders Panel
Moderator: Prof. Tony Chan, President, Hong Kong University of Science and Technology, Hong Kong
- Prof. Teck Seng Low, Managing Director - Agency for Science, Technology and Research (A*STAR), Singapore
- Dr. Jan Färjh, Head of Ericsson Research, Sweden
- Dr. Rico Malvar, Chief Scientist of Microsoft Research, USA
- Prof. Ada Poon, EE Department, Stanford University, USA
- Prof. Shigeru Sasaki, Senior Vice President, Fujitsu Laboratories Ltd., Japan
- Prof. Henning Sirringhaus, Hitachi Professor of Electron Device Physics, Cavendish Laboratory, University of Cambridge, UK
HOW: To register for the inaugural IEEE Technology Time Machine Symposium, please visit: http://www.techbeyond2020.ust.hk/register.html.
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