Littleton, Colorado (PRWEB) June 14, 2011
“We are pleased that CPI has chosen NXP’s payment solution for its latest dual interface product. Our proven, reliable and secure contactless solutions will help facilitate the migration to EMV systems in North America, providing greater financial security for consumers,” said Karsten Danziger, director of banking solutions for NXP Semiconductors. “The migration also provides an opportunity for banks to provide additional consumer benefits such as advanced services and applications. NXP is uniquely positioned, with our market leadership in mobile payments, near field communication, smart ticketing and infrastructure solutions, to lead this innovation.”
CPI is also proud of being the only manufacturer in North America offering the Smart Packaging Solutions (SPS) reliable technology for the dual interface card construction. "Our unique dual interface solution based on the electromagnetic coupling concept is the ideal platform for a large volume of high quality and secured cards as the banking market requires," said Ivan Peytavin, area sales director, Americas - West of Europe & Pacific for SPS. “We have had a longstanding and successful relationship with CPI and are pleased that they have decided to use SPS solution for their dual interface cards production, especially with this new product dedicated to VISA issuers.”
“CPI is very pleased with the NXP and SPS partnership as it will help us offer our customers a new alternative. Our first target market will be in Canada, where our Toronto facility is fully certified in producing and personalizing EMV cards,” said Benoit Guez, Director of Smart Cards and New Technology. “CPI is also offering dual interface cards to EMV markets in the U.S., Europe and Latin America, providing full support to financial institutions with their EMV strategies.”
The CPI qualified solution is based on the NXP SmartMX dual interface solution with 12K EEPROM memory. NXP’s portfolio of SmartMX products has been vetted by independent evaluation labs in numerous Common Criteria and EMVCo certifications. The devices feature advanced security concepts including the patented GlueLogic design methodology, dedicated hardware firewalls to protect software and data, and a comprehensive suite of technologies addressing attack scenarios with light and lasers. In addition, the ICs provide faster reading and writing capabilities due to optimized hardware and software. NXP’s SmartMX products have also passed Cryptography Research Inc’s stringent DPA Countermeasure Validation Program for smartcards.
Over the last five years, CPI Card Group has become the largest global manufacturer of financial contactless cards, having delivered over 110 million contactless financial cards to the North American market. With the emergence of EMV in North America, CPI stands ready to assume the same leadership position in delivering EMV solutions to its customers.
About CPI Card Group
CPI, a global leader in financial, commercial and identification card production and related services, offers a single source for plastic cards and other form factors, from foil cards and holograms to translucent and smart cards, and personalization and fulfillment services. CPI offers the largest production capacity in North America. CPI's production sites include Denver, Colorado; Fort Wayne, Indiana; Las Vegas, Nevada; Colchester, England; Liverpool, England; and Toronto, Canada. CPI's plants in Colorado, Nevada, and Liverpool are ISO 9001 certified. For more information, visit http://www.cpicardgroup.com.
About NXP Semiconductors
NXP Semiconductors N.V. provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting http://www.nxp.com.
About Smart Packaging Solutions (SPS)
SPS is a global leader in reliable technologies involving contactless and dual interface smart cards, and a leading provider of high-quality inlays for e-Passports. Based in Rousset (Bouches-du-Rhône, France) and backed by around 90 staff, the company is positioned on markets for electronic ID and bank cards. Its market offering is based on an unrivalled proprietary patented technology (portfolio of more than 120 patents) that it provides for large end-customers including governments, national printing houses and smart card manufacturers etc. For more information, visit http://www.s-p-s.com