Carsem Receives Exar’s Supplier of the Year Award

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Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received Exar Corporation's FY2011 Supplier of The Year Award for assembly and test services that were provided by the Carsem factories located in Ipoh, Malaysia.

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received Exar Corporation's FY2011 Supplier of The Year Award for assembly and test services that were provided by the Carsem factories located in Ipoh, Malaysia. The award is based several criteria including the quarterly scorecard performance, as well as effort and flexibility in terms of operations, quality, deliveries and cost indices.

Exar’s CEO and President, Pete Rodriquez, presented the award in a ceremony held at Exar’s headquarters located in Fremont, Calif.

Mr. Rodriquez stated, “Carsem is one of our key suppliers providing assembly, final test and drop ship services for many products and a variety of package types. This past year Carsem has done an exceptional job and we are looking forward to their continued support.”

Mr. Peter Yates, Carsem’s Group Managing Director added, “The Ipoh factory team has done an outstanding job in supporting Exar’s needs and we are extremely pleased to receive this special recognition. Our dedicated team will continue to stay focused on our strong partner relationship with Exar well into future.”

About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.

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Albert Law
Carsem
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