Scotts Valley, CA (PRWEB) October 15, 2012
Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that Mr.Allan Calamoneri has assumed the responsibilities of Vice President of Sales, North America effective immediately. Mr. Calamoneri is based in the Scotts Valley, California office and reports to Mr. Albert Law, Carsem’s V.P. of World Wide Sales and Marketing.
Allan Calamoneri is a dynamic senior executive with COO experience and a track record of successful results in both domestic and international management roles. His 23 year career in the semiconductor industry will be a true advantage to Carsem. Associated with Carsem Inc. since 2004, in his most recent experience as Vice President of Test Business Development he has exhibited a sharp focus on technical strategy development, market positioning and timely disciplined execution of business opportunities. Henceforth, in this expanded role Allan will have responsibility for the entire selling organization of Carsem in North America. Reporting to Allan are Three Regional Sales Directors and a Technical Sales Director.
Mr. Law stated, “I am very pleased to have Allan to take on this role to drive execution, effectiveness and efficiency. With our new business strategy, Allan will work to build sustainable business relationships between Carsem and potential clients that will provide the platform for our planned future growth and expansion into new markets. We look forward to Allan’s contribution to our continued growth.”
”I look forward to taking on the economic and technical challenges associated with a rapidly changing global semiconductor environment. I am dedicated to providing the required leadership and focus to implement technology driven solutions to mitigate our customers supply chain risks and provide for sustainable growth.” stated Mr. Calamoneri.
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.