(PRWEB) December 13, 2012
Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that the U. S. Court of Appeals for the Federal Circuit has denied the petition for re-hearing of the Case number 2010-1550 (US Court of Appeals for the Federal Circuit : Amkor Technology Inc. vs. International Trade Commission).
Peter Yates, Carsem Group Managing Director stated, “We are disappointed with this decision by the U. S. Court of Appeals for the Federal Circuit, however, we are pleased to confirm that the US Patent Office has on 7th December 2012 granted Carsem’s request for re-examination of all claims of the patent in question. We remain confident the eventual outcome will again support Carsem’s position.”
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.