NXP Introduces LIN Transceiver for Smaller, Lighter and More Cost-Efficient ECU Designs

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TJA1027 meets manufacturer demands for simplified device.

NXP TJA1027 transceiver

The NXP TJA1027 LIN transceiver enables smaller, lighter, more cost-efficient ECUs in cars

We developed this product in collaboration with major automotive manufacturing customers, responding to their need for a simpler and more cost-effective transceiver that still offers full functionality.

NXP Semiconductors N.V. (NASDAQ: NXPI) – the world’s largest supplier of in-vehicle networking (IVN) semiconductors – today announced the availability of the TJA1027, a standalone LIN 2.2 transceiver that enables smaller, lighter and more cost-efficient electronic control units (ECUs) in cars. The TJA1027 is ideal for body control and gateway modules, particularly where there are board space constraints due to high node count, and also for typical slave applications such as electrical window lifters or HVAC (heating, ventilation and air conditioning) systems.

The TJA1027 was designed in response to manufacturer demands for a simpler transceiver while still preserving the core functionality required for typical automotive ECU applications. By removing the local wake-up input and battery-related inhibit output features, the TJA1027 enables more cost-effective designs.

The new transceiver is available in two package variants – a standard SO8 package, plus a leadless HVSON8 package. Approximately 70-percent smaller and lighter than a conventional SO8 package, the HVSON8 is eco-friendly and saves space. Its compact size and reduced weight enables smaller, more cost-effective ECU modules, helping to reduce CO2 emissions. In addition, the HVSON8 package uses a “dark green” molding compound that is free of halogen and meets the RoHS (Restriction of Hazardous Substances) standard. The HVSON8 package has identical pin-out as the industry standard LIN transceiver in SO8, which eases the package adoption.

The TJA1027 integrates high protection against ESD pulses (+/- 8kV according to IEC 61000-4-2) on the bus pin. Thus, it further reduces system costs by removing the need for external ESD protection diodes while offering an excellent EMC profile, meeting the latest requirements of car OEMs.

“The release of the TJA1027 is another proof point of NXP’s technology and market leadership in in-vehicle networking semiconductors. We developed this product in collaboration with major automotive manufacturing customers, responding to their need for a simpler and more cost-effective transceiver that still offers full functionality,” said Stephan Rave, product marketing manager, NXP Semiconductors. “The TJA1027 is also another example of our support for the HVSON package, which we believe is the next step in the evolution of in-vehicle networking transceivers.”

Features

  •     LIN 2.0/2.1/2.2 SAE J2602 compliant
  •     Pin compatible subset of TJA1020/TJA1021
  •     Small packages
  •     SO8 (5 x 6.2 x 1.75 mm)
  •     HVSON8 (3 x 3 x 0.85 mm)
  •     Low power ‘sleep’ mode with remote wake-up function
  •     Compatible to 3.3V & 5V Microcontroller
  •     Operation supply voltage range
  •     5.5-18 V
  •     High ESD protection +/- 8kV according to IEC 61000-4-2
  •     For LIN and Vbat pins
  •     Excellent EMC performance
  •     strong RF immunity (DPI/BCI)
  •     low RF emission
  •     Passive behavior
  •     if unsupplied (no LIN bus leakage current)
  •     undervoltage detection
  •     Short-circuit proof
  •     K-line compatible

Availability
The TJA1027 is available now.

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About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting http://www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP’s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP’s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP’s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers’ equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP’s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP’s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, http://www.nxp.com/investor or from the SEC website, http://www.sec.gov.

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