Carsem Receives Allegro Supplier Excellence Award

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Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that it has received a 2011 Supplier Excellence Award from Allegro MicroSystems, Inc. for assembly and test services that were provided by the Carsem factory located in Suzhou, China.

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that it has received a 2011 Supplier Excellence Award from Allegro MicroSystems, Inc. for assembly and test services that were provided by the Carsem factory located in Suzhou, China.

According to Marc Levesque, Sr. Director, Supply Chain Management, "Over the past several years Suzhou has consistently ranked very high on Allegro's list of suppliers. Suzhou's overall commitment to quality, delivery/cost, customer satisfaction and technology has been highest in class and has set a new standard for your competitors. We congratulate Suzhou on receiving the Allegro Supplier Excellence Award and we encourage you to continue to strive for perfection!"

The award will be presented to TW Hee, GM of Carsems Suzhou facility by Mr. Marc Levesque, Allegro's Sr. Director Supply Chain Management. Mr. Levesque stated, "Allegro's 2011 Excellent Award recognizes suppliers who, in 2011, had achieved a total score for quality, delivery, customer satisfaction and technology of greater than 90%".

Mr. Peter Yates, Carsem's Group Managing Director added, "Carsem is honored to be recognized for our achievements in providinghigh volume MLP packaging services. With the tremendous growth in demand for our MLP packages, this award is a reflection of our focus and commitment to expand our Suzhou factory in phase 2 assuring our customers of an uninterrupted supply in both assembly and test".
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About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.

About Allegro
Allegro MicroSystems, Inc. is a leader in developing, manufacturing and marketing high-performance power and Hall-effect sensor integrated circuits. Allegro's innovative solutions serve high-growth applications within the automotive market, with additional focus on office automation, industrial, and consumer/communications solutions. Allegro is headquartered in Worcester, Massachusetts (USA) with design, applications, and sales support centers located worldwide. Allegro's product, corporate and financial information are available at their website: http://www.allegromicro.com

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Albert Law
Carsem
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