NXP Introduces Dual LIN Transceiver for Smaller, Lighter and More Cost-Efficient Modules in the Car

TJA1022 dual LIN-channel standalone transceiver combines a smaller footprint with more functionality in a single package.

  • Share on TwitterShare on FacebookShare on Google+Share on LinkedInEmail a friend
NXP TJA1022 transceiver

TJA1022, a dual LIN 2.2 transceiver

Eindhoven, Netherlands and Hamburg, Germany (PRWEB) June 12, 2012

NXP Semiconductors N.V. (NASDAQ: NXPI) – the world’s largest supplier of in-vehicle networking semiconductors – today announced the availability of the TJA1022, a dual LIN 2.2 transceiver that provides an interface between a LIN master/slave protocol controller and the physical bus in a LIN network. It combines two LIN transceivers into a single package, offering more compact, flexible and cost-efficient modules in the car. The TJA1022 is primarily intended for modules with multiple LIN sub-networks such as body control modules, gateway modules, and intelligent parking assistance that enhance passenger comfort and the overall driving experience.

“As the number of electronic control units in the car is growing, there is an increasing need for LIN nodes in networks, creating pressure for manufacturers to respond to larger system complexity,” says Toni Versluijs, vice president and general manager, In-Vehicle Networking, NXP Semiconductors. “We developed the TJA1022 in collaboration with major automotive manufacturing customers around the world, responding to their needs for a product which would offer more functionality in a smaller footprint.”

The TJA1022 offers module suppliers the possibility to further reduce design costs by eliminating the need for an external protection diode due to excellent intrinsic ESD protection of the transceivers. The TJA1022 is LIN 2.0, LIN 2.1, LIN 2.2 and SAE J2602-compliant, as well as compatible with K-Line. It is also fully software and pin-compatible with other NXP LIN products including the TJA1027, and thus supports a flexible, scalable platform approach.

For convenience, the new transceiver is available in two package variants: an SO14 package and an HVSON14 package. The HVSON (Plastic thermal enhanced very thin small outline package; no leads) packages are the next step in evolution of packages for automotive in-vehicle networking transceivers, while the leadless dark green RoHS (halogen free and Restriction of Hazardous Substances) packages are compliant with improved Automated Optical Inspection (AOI) capability. Both packages are automotive-qualified according to AEC-Q100 grade 1.

Key Features

  •     Two LIN transceivers in a single package
  •     LIN 2.0, LIN 2.1, LIN 2.2 and SAE J2602 compliant
  •     Baud rate up to 20 kBd
  •     Very low ElectroMagnetic Emissions (EME)
  •     Very low current consumption in Sleep mode with remote LIN wake-up
  •     Input levels compatible with 3.3V and 5V devices
  •     Integrated termination resistors for LIN slave applications
  •     Passive behavior in unpowered state
  •     Operational during cranking pulse: full operation from 5V upwards
  •     Undervoltage detection
  •     K-line compatible
  •     Available in SO14 and HVSON14 packages
  •     Leadless HVSON14 package (3.0 mm × 4.5 mm) with improved Automated Optical Inspection (AOI) capability
  •     Dark green product (halogen free and Restriction of Hazardous Substances (RoHS) compliant)
  •     Pin-compatible with the TJA1020, TJA1021 and TJA1027
  •     Software-compatible with the TJA1027

Availability
The TJA1022 is currently available for both sampling and volume production.

Links

http://www.nxp.com/products/interface_and_connectivity/transceivers/lin_transceivers/#overview

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting http://www.nxp.com.

  • ENDS -

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP’s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP’s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP’s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers’ equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP’s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP’s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, http://www.nxp.com/investor or from the SEC website, http://www.sec.gov.


Contact

Attachments