With Ultra Fusion 300, we are extending the benefits of our latest Fusion™ platform and its innovative Multi-Image Technology™ to support the challenging production of the industry’s most complex IC substrates.
Yavne, Israel (PRWEB) June 14, 2012
Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs), today announced that it has expanded its Ultra Fusion™ series of automated optical inspection (AOI) systems. The new Ultra Fusion™ 300 is designed to support the production of advanced IC substrates down to 10μm.
In addition to Ultra Fusion 300, the Company also offers the recently launched Ultra Fusion 200 for IC substrate and advanced HDI production down to 15μm.
Mr. Richard Klapholz, President of the PCB Division at Orbotech Ltd., said: “With Ultra Fusion 300, we are extending the benefits of our latest Fusion™ platform and its innovative Multi-Image Technology™ to support the challenging production of the industry’s most complex IC substrates.“
Featuring powerful Multi-Image Technology™, Ultra Fusion achieves a major reduction in false alarms of up to 70% compared to conventional AOI results. Unlike traditional, gray-scale AOI, inspection is performed using different lights and from different angles revealing details that are unseen by other systems. Ultra Fusion utilizes an innovative optical head specially designed to accommodate the specific requirements of semi-additive processes (SAP/mSAP). A patented vacuum table supports a wide variety of materials for maximum inspection flexibility. With online verification capabilities built into the system, Ultra Fusion provides fast and easy access to the defect area, reducing handling damage and scrap. The system’s Smart Setup operation transforms the traditional AOI setup process – from a trial-and-error one to a single smooth cycle with minimal process steps.
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ/GSM: ORBK) has been at the cutting edge of the electronics industry supply chain, as an innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products, for over 30 years. The Company is a leading provider of yield-enhancing and production solutions, primarily for manufacturers of printed circuit boards, flat panel displays and other electronic components; and today, virtually every electronic device is produced using Orbotech technology. The Company also applies its core expertise and resources in other advanced technology areas, including character recognition for check and forms processing and solar photovoltaic manufacturing. Headquartered in Israel and operating from multiple locations internationally, Orbotech’s highly talented and inter-disciplinary professionals design, manufacture, sell and service the Company’s end-to-end portfolio of solutions for the benefit of customers the world over. For more information please see the Company’s filings with the U.S. Securities and Exchange Commission at http://www.sec.gov. and visit the Company’s corporate website at http://www.orbotech.com. The corporate website is not incorporated herein by reference and is included as an inactive textual reference only.