Seattle WA (PRWEB) June 21, 2012
MicroConnex, a leader in Flex Circuit design and laser micromachining recently acquired their second ESI 5330HE Laser processing system. That’s a total of four ESI laser systems for MicroConnex.
“What’s great about this acquisition,” says MicroConnex laser specialist Ben Ross, “isn’t just that it increases our capacity. Perhaps more importantly, it gives us an additional edge in our ability to do things nobody else can do with these systems.”
MicroConnex has already established an industry-wide reputation for their unique ability to tackle particularly vexing laser micromachining and microvia challenges.
“One of the things we do better than most is to push the capabilities of the ESI laser systems and develop new processes that can produce extremely high accuracy with miniscule features,” adds Ross. Now that they have two of the top laser systems on the market, MicroConnex can simultaneously increase capacity and continue to advance laser micromachining, microvia, skiving, and contouring processes.
“The result,” says Ross, “is that we can increase our throughput and our accuracy at the same time, while also pushing the limits of what you can do with different materials. I’m not sure anyone else is doing that.”
Wayne VanZandt, marketing manager for MicroConnex adds, "We've got a couple of applications we're working on that are so different, and consequently so secret, that I'd have to shoot anyone I told. I honestly don't believe that anyone has considered doing these things with a laser."
MicroConnex laser engineers are chomping at the bit to, as Ross so elequently says, "Go where no laser micromachining process has gone before." He adds that, “It all comes down to streamlining the processes. It’s what our customers want, and we can develop processes for new applications more quickly than ever.”
The addition of a second 5330HE laser means that MicroConnex can almost double their range of capabilities and double their throughput while increasing accuracy.
About the ESI 5330HE Laser Processing System
The ESI 5330HE is optimized for glass reinforced and ceramic material and incorporates a high pulse energy diode-pumped laser with pulse energy of up to 800 millijoules per pulse. The modular optical system is designed to support the various optical configurations required to meet the needs of the industry. The combination of a high-power laser with a high-speed Beam Positioner enables the system to cut glass reinforced dielectrics with excellent quality and high productivity.
MicroConnex is an established leader in laser micromachining and flex circuits. They easily incorporate smaller, lighter and more reliable flex circuits in product designs by using patented electrical technology, proprietary connective techniques, advanced laser processes and thin-film sputtering capabilities. MicroConnex flex and rigid-flex circuits are used in applications where lightweight, ultra-compact design and reliability are all critical.
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For more information about this topic, or to speak with a MicroConnex representative, please call Wayne VanZandt at 425-396-5707 or email Wayne at wvanzandt(at)microconnex.com. URL: http://www.microconnex.com