NXP Ships LPC11U30 USB Microcontrollers with 128KB Flash

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NXP's award-winning LPC11U00 family of USB microcontrollers based on ARM Cortex-M0

Eindhoven, Netherlands and San Jose, California (PRWEB) June 25, 2012

NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the LPC11U30 series of easy-to-use, very low-power USB microcontrollers based on the ARM® Cortex™-M0 processor. Available immediately from major distributors worldwide, the LPC11U30 extends memory options for the award-winning LPC11U00 family with up to 4 KB of EEPROM, 12 KB of SRAM and 128 KB of NXP’s embedded flash with 256 bytes of erase sector. With extra-low active power consumption as low as 110 uA/MHz, the LPC11U30 microcontrollers are ideal for USB 2.0 applications requiring large memory sizes for local storage such as gaming mice and keyboards, glucose meters, and remote-controlled toys.

The LPC11U30 supports the latest USB 2.0 specification with Link Power Management (LPM) mode, which allows a device to enter a suspended state when not in use. It also offers on-chip power profiles optimized for specific power levels, including a Low Current mode ideal for battery-powered applications that only connect to USB for occasional charging or data download. With multiple USB drivers integrated into ROM, the LPC11U30 microcontroller maximizes flash memory utilization and provides fully tested APIs that enable easy USB integration, which can be further enhanced by using nxpUSBlib, NXP’s fully featured open source USB library.

Features
Key specifications for the LPC11U30 devices include:

•     ARM Cortex-M0 processor, up to 50 MHz
•     40 KB to 128 KB Flash, up to 12 KB SRAM
•     4 KB EEPROM
•     Integrated ROM drivers including Human Interface Device (HID), Mass Storage Device Class (MSC), and Communication Device Class (CDC)
•     Selectable USART with Smart Card Interface/UART, 2 SSP, I2C (Fm+)
•     8-channel high-precision 10-bit ADC with ±1LSB DNL
•     Two 16-bit and two 32-bit timers with PWM/Match/Capture
•     12 MHz internal RC oscillator with 1 percent accuracy over temperature and voltage
•     Up to 54 GPIOs
•     Packages include TFBGA48, HVQFN33 (5 mm x 5 mm and 7 mm x 7 mm), LQFP48/64

Availability
Product samples of LPC11U30 series microcontrollers are available now from NXP distributors and sample stores. Development boards for the LPC11U30 series are available immediately through Embedded Artists, which offers a QuickStart board based on the LPC11U35 in an HVQFN33 package, and through NGX Technologies, which offers a development board based on the LPC11U37 in an LQFP48 package.

Links

•     LPC11U30 product information:

•     NXP’s open source USB library:

•     Embedded Artist LPC11U35 QuickStart Board information page: http://www.embeddedartists.com/products/boards
•     NGX Technologies LPC11U37 Development Board information page: http://shop.ngxtechnologies.com/product_info.php?products_id=114

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting http://www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP’s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP’s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP’s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers’ equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP’s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP’s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, http://www.nxp.com/investor or from the SEC website, http://www.sec.gov.

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