By bringing such a unique product to market, you really start to see the future of electronics begin to reveal itself.
Lake Forest, CA (PRWEB) July 05, 2012
Integral Technology, Inc. (http://www.integral-hdi.com), a manufacturer and distributor of HDI electronic materials for the printed circuit board industry, has announced it has signed a 5-year agreement to sell and distribute Ormet Circuits (http://www.ormetcircuits.com) products. These interlayer electrical interconnects are used within printed circuits boards to provide high electrical, thermal conductivity and adhesion to the PCB substrates.
Integral CEO Tim Redfern stated, “This is an important development as Integral continues to grow our position in creating the next generation HDI printed circuit boards. We are excited to develop Ormet’ s business and to bring this exciting new material to the printed circuit board market using our technology and established channels to market.
“Ormet’ s processing offers a strong value proposition in regards to reliability, time to market, capital equipment savings and environmental improvements used to make next generation PCB’s.” Redfern added.
Ormet President Michael Matthews agrees, “Ormet™ sintering materials technology enables a next generation of high density, high performance PCBs by eliminating the need for back-drilling and high-aspect-ratio plated through holes.
“Ormet Circuits is pleased to work with Integral to take the business to the next level. Ormet is looking forward to working with Integral at the OEM’s and ODM’s as well as at the PCB fabricators in order to increase our position in markets requiring advanced PCB designs,” Matthews concluded.
Integral President Ken Parent added, “Integral Technology brings together manufacturers of PCB technology with technically capable channels to market to those who require advanced materials. By bringing such a unique product to market, you really start to see the future of electronics begin to reveal itself.”