Ronkonkoma, NY (PRWEB) July 13, 2012
Advanced Component Testing is excited to announce their expansion into full functional Electrical Testing, including Group A capabilities by investing into the latest equipment and technology for electronic component testing. This is an enhancement to their already large selection of testing services. The lab was developed to meet the overwhelming demand for testing and screening in the electronic components sector due to high risks of counterfeit parts within many companies supply chain.
ACT is at the forefront of identifying electronic components suspect of being counterfeit or substandard within the mil-aerospace, commercial, medical and automotive industries.
Advanced Component Testing is always looking at ways to broaden their electronic component testing capabilities and offer the latest in testing techniques. The upgrade to offer full functional Electrical testing, including Group A, was to increase their ability to test component device’s full functional and parametric requirements at the recommended manufacturer’s operating temperatures. Offering testing techniques that now can be quantified as well as a variety of component verification methods.
“We are dedicated to using the most current counterfeit detection technology combined with our proprietary database, experienced engineers, testing procedures and state of the art equipment to make ACT a leader in detection counterfeit components” said Mike Zambito, VP of Operations for Advanced Components Testing.
This latest capabilities of full Electrical Testing and Group A testing is now giving Advanced Component Testing an advantage to offer their customers extremely competitive pricing and reduced lead times. Their project management and logistic experience provides consistent and systematic approach to their testing each and every time.
About ACT’s Product Authenticity Services:
Electrical Testing, Group A Electrical Testing, Solderability, IC Decapsultation/De-lidding, Internal Visual Die Verification, Material Analysis/Device Composition, Component Surface Inspection, X-ray Die Bond and Frame Verification, Physical Dimension, Marking Permanency, XRF Spectrum Analysis, Comprehensive report, Proprietary OCM Die database, Engineering review, Solderability Testing, Bake/Dry Pack, Tape/Reeling.
For more information visit: http://www.actestlab.com
Tim Nese, Advanced Components Testing
+ 1 (631) 676‐6390