Livermore, CA (PRWEB) August 20, 2012
Yield Engineering Systems, Inc. (YES), a wafer level packaging process equipment manufacturer, announced today that they will be exhibiting at The 9th Annual International Wafer Level Packaging Conference (IWLPC) being held at the Doubletree by Hilton Hotel in San Jose on November 7-8, 2012. YES will be located at Booth #2.
YES manufactures a wide variety of processing equipment including high reliability tools for Wafer Level Packaging (WLP) type processes with a low-cost of ownership. The YES-VertaCure Series and the YES-450PB-HV (High Vac) use high temperature and high vacuum to achieve metal annealing, wafer dehydration and getter activation. These processes are vital to the success of wafer level packaging.
“IWLPC brings together influential individuals and companies in the semiconductor industry addressing wafer-level and MEMS device packaging,” said Bill Moffat, Founder and CEO of YES, “the MEMS industry is developing rapidly and YES is positioning itself to be a part of that growth.”
For more information regarding the YES-VertaVac or YES-450PB-HV, visit http://www.yieldengineering.com or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353.
About Yield Engineering Systems, Inc.
YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, photovoltaic, FPD, MEMS, medical, nanotech industries and more.
They manufacture high temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.