Revolutionary ZETA® Laminate Receives U.S. Patent; Printed Circuit Board Industry Takes Note

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Lake Forest innovator Integral Technology announces patent for new printed circuit board business product.

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helping to define the future of electronics

Zeta® Cap, a glass-free laminate produced by Integral Technology , a manufacturer and distributor of HDI electronic materials for the printed circuit board industry, has received US Patent No. 8,188,373. The patent was filed as an improved insulating layer for rigid printed circuit boards.

Zeta® Cap and other related laminates have become the products to watch as these new dielectric films offer sweeping solutions as to how printed circuit boards can be constructed.

The game-changing films are a family of several proprietary materials designed to help OEMs and printed circuit fabricators compete with new demands in electronics manufacturing brought on by the need for miniaturization, multiple lamination cycles, and high thermal and electrical properties.

Integral CEO Tim Redfern stated, “The patent for Zeta® Cap is an important landmark in the development of our new Zeta family of glass-free laminates. A patent indicates that its holder developed an innovative and new product and that’s its value is protected. We are happy to bring this exciting new material to the printed circuit board market.”

The results from using Zeta products are nothing short of extraordinary and well worth quality assurance provided by certification. Newly patented Zeta® Cap is a copper-clad, high Tg C-stage glass-free laminate designed to eliminate pad cratering in circuit board assembly. Zeta® Lam, a related dielectric film, allows ultra-thin HDI buildup layers (down to 12 microns) with improved thickness uniformity and transmission line performance. Zeta® Bond is a proprietary glass-free B-stage bonding film capable of filling circuits and vias.

Pad cratering, which Zeta® Cap eliminates, is being recognized as a serious and evolving challenge for the PCB industry. It is a mechanically induced fracture in the resin between the copper foil and the outermost layer of fiberglass in a printed circuit board. The pad can remain connected to the component leaving a “crater” on the surface of the PCB board. It is impossible to detect without cross-sectioning a failed board.

Zeta® Cap virtually prevents pad cratering, once laminated to the surface as a cap, by acting as a shock absorber to prevent fracture formation.

The Zeta laminates are precision applied to exacting specifications. To ensure rigorous standards of installation are met, PCB fabricators must commit to a Zeta® certification program where process and equipment are brought into the standards required by these sophisticated glass-free dielectric laminates. This quality-assurance recognition indicates to OEMs, original equipment manufacturers, which fabricators are Zeta-certified.

“Integral Technology brings together our customers who build printed circuit boards and OEMs who require advanced materials,” Integral president Ken Parent stated. “With all that’s changing in our industry, we are definitely helping to define the future of electronics.”

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