Carsem Announces Reversal of the U. S. International Trade Commission (ITC) Decision in the Ongoing Patent Litigation between Amkor and Carsem

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Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that the U. S. Court of Appeals for the Federal Circuit has reversed the U. S. International Trade Commission (ITC) decision in the ongoing patent litigation between Amkor and Carsem.

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that the U. S. Court of Appeals for the Federal Circuit has reversed the U. S. International Trade Commission (ITC) decision in the ongoing patent litigation between Amkor and Carsem. Case number 2010-1550 (US Court of Appeals for the Federal Circuit: Amkr Technology Inc –vs- International Trade Commision)

The Court has remanded the matter to the ITC for further proceedings consistent with the decision, and Carsem now has 45 days in which to file a petition for re-hearing.

Peter Yates, Carsem Group Managing Director stated, “Given the final ITC determination in our favour, this decision is disappointing, but we are preparing to file a petition for re-hearing and we are confident that the eventual outcome will again support Carsem’s position.”

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip On Leadframe (FCOL), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.

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Sharen Kartar
Carsem Inc.
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