OEMs are well into two-layer, processor and memory chip, PoP at the 0.5mm pitch BGA levels. But there’s a definite game changer going into 0.4mm pitch and beyond BGA PoP technology.
(PRWEB) September 06, 2012
NexLogic Technologies, Inc., a complete one-stop shop for PCB design, fabrication, assembly, and test today announced it will participate at the PCBWest 2012 Technical Conference scheduled for September 25-26 at the Santa Clara Convention Center.
Topic of NexLogic’s hour-long conference paper and presentation is a tutorial on package on package (PoP)-based PCB design and assembly. The presentation/Session A4 is scheduled for Wednesday, September 26 at 1:30 pm.
NexLogic’s President, Zulki Khan, said, “Today, package on package technology is making greater inroads into new products based on both large and small printed circuit boards (PCBs). OEMs are well into two-layer, processor and memory chip, PoP at the 0.5mm pitch BGA levels. But there’s a definite game changer going into 0.4mm pitch and beyond BGA PoP technology. And that’s where we’ll focus our discussion on cutting edge PoP design and assembly technologies at PCBWest 2012.”
Included in the hour-long presentation, Mr. Khan and his design staff, will place emphasis on design factors affecting PoP-populated PCBs. Those include pad design, via in pad guidelines, via definitions, and fan out requirements. In particular, concentrated discussion will be on pad design considerations at 0.4mm ultra-fine pitch PoP-BGAs and lower.
NexLogic’s PoP coverage will also include knowing PCB fabricator’s limits and details the top three categories of board fabricating capabilities. The third portion of the discussion goes toward PoP-populated PCB assembly challenges, what the OEM can expect, and the best ways to overcome those challenges with assembly floor trained personnel and creative measures using today’s assembly equipment.