NXP Extends ESD Protection Portfolio for High-Speed Interfaces

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15 Circuit-protection devices offer unique combination of ultra-low clamping and ultra-low capacitance

NXP IP4294 in DFN2510A-10

The NXP IP4294 is housed in a leadless DFN2510A-10 (SOT1176) package

NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s leading supplier for ESD (electrostatic discharge) protection, today announced its expanded range of circuit protection devices combining both ultra-low capacitance and ultra-low clamping voltages. With high ESD robustness exceeding IEC61000-4-2 level 4 on system level, NXP’s ESD protection portfolio now includes 15 devices ideal for protecting high-speed signal lines such as HDMI, MHL, MIPI, DisplayPort, eSATA, Thunderbolt, USB 3.0/2.0 and Ethernet.

Highlights of the latest additions to NXP’s ESD protection portfolio include:

  •     Deep snapback combined with very low dynamic resistance. Highly sensitive to ESD pulses, the latest system-on-chips (SoCs) for ultra-high-speed data lines require system-level circuit protection up to 10 kV (IEC61000-4-2), as well as extra support for signal integrity. The NXP IP4294CZ10-TBR and IP4369CX4 are designed to protect even the most sensitive high-speed interfaces: They offer a unique blend of deep snapback (2.95 V typ @ 1A) and a very low dynamic resistance of only 0.4 Ohm and 0.2 Ohm, respectively. The IP4294 is already used for USB 3.0 applications by major players in the industry and offers the strongest overall SoC protection against ESD pulses. It is housed in a leadless DFN2510A-10 (SOT1176) package that is designed for pass-through routing which optimizes signal integrity and simplifies board layout. The IP4369, with only 0.8 pF (typ), provides the strongest SoC protection in the popular WLCSP4 (Wafer Level Chip Scale package) footprint.
  •     Low clamping / standard breakdown devices. NXP also provides low clamping parts without snapback for universal use, including applications connected to DC current sources with high current limits, such as Vbus. These include uni- and bi-directional ESD protection devices up to 5 lines such as PESD5V0X1BCL, PESD5V0X1BCAL, PESD5V0F5UV or the PESD5V0X1U family. These devices offer best-in-class overshoot and clamping voltages (of 7.5 V after 30 ns for an 8 kV ESD pulse, in compliance with IEC61000-4-2) and ultra-low capacitance down to 0.49 pF (typ).
  •     Strongest protection in a tiny footprint. NXP offers package options, including very small and thin plastic SMD and WLCSP down to the 0603 form factor (DSN0603-2, 0201 inch). Other options include NXP’s innovative leadless solderable side pads package, which enables visual inspection and provides very robust soldering (DFN1006D-2). These ultra-compact packages make the NXP circuit protection portfolio especially well-suited for space-constrained applications such as smartphones, players, tablets and eReaders.


About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting http://www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP’s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP’s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP’s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers’ equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP’s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP’s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, nxp.com/investor or from the SEC website, sec.gov.

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