Ardent Begins Shipments of New High Performance Stamped Contact Socket System for Large Area Arrays

Patented Multi-GHz RC Connect-R Sockets are designed for Large FPGAs, ASICs, and Processors

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Stamped Contact, Molded Housing High Density High Frequency BGA Socket System

Ardent Universal BGA Socket

We can now give our customers an alternative to pogo pins and conductive elastomerics at a price point which can't be beat

Seabrook, NH USA (PRWEB) September 16, 2012

Ardent Concepts, the leader in high speed compression mount interconnect, has started shipping their latest IP in test sockets for large area array BGA and LGA devices. With molded housings and stamped contact sets, RC Connect-R BGA/LGA Universal sockets provide exceptional signal integrity and mechanical stability at a fraction of the cost of traditional machined sockets, and are available for package sizes up to 50mm x 50mm.

"We are very pleased to have moved into mainstream manufacturing on this product", says Steve Cleveland, Vice President of Business Development. "Finding a way to make this size mold and automate the assembly were big hills to climb. We can now give our customers an alternative to pogo pins and conductive elastomerics at a price point which can't be beat while still meeting the needs for increased AC performance."

RC Connect-R is Ardent's patented stamped contact technology which provides multi-GHz AC performance and durability. The technology has been qualified for flight applications and operates both hot and cold temperatures with consistent AC and DC performance.


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