Cranston, Rhode Island (PRWEB) January 23, 2013
AIM Solder announced that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo, booth #1302, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.
The new flux is formulated to offer a very wide process window and is excellent in extended dwell times. It also offers a broad activation range, proving to be an outstanding flux for a variety of process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys.
“NC277 Liquid Flux is a VOC-free flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands,” stated Karl Seelig, V.P. of Technology.
Additionally, NC277 offers low-fuming and fast solvent evaporation. The flux is designed to be no-clean, non-visible residue flux, which can be cleaned if critical to the product application. It also has proven to reduce preventative maintenance requirements for spray fluxing applications.
AIM will also feature its tin-lead and lead-free solder alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium.
To discover all of AIM’s products, including lead-free and halogen free solder, visit the company at booth #1302 at the IPC APEX Expo or visit http://www.aimsolder.com.
Headquartered in Montreal, Canada, with locations worldwide, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing, and other industries.