Smart Packaging Solutions (SPS) And CPI Card Group Achieve a New Step in Dual Interface Card Production and Personalization

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Smart Packaging Solutions (SPS) and CPI Card Group have successfully implemented a reliable production, personalization and fulfillment process specifically adapted to dual-interface EMV cards for the American market.

SPS CPI

SPS and CPI achieve a new step in dual interface card production and personalization

The combination of CPI embedding and personalization expertise with SPS EBooster® technology offers the market a unique, high performance production capability for dual interface cards with a unique stability of the card quality. - Ivan Peytavin, SPS

Smart Packaging Solutions (SPS), an expert in smart card technologies, and CPI Card Group, a leader in financial, EMV and Commercial payment solutions, are pleased to announce that high productivity and reliability for inline production and testing of dual interface cards for the financial market has been achieved. Thanks to SPS technology, CPI Card Group is positioned to deliver high quality dual interface cards to US-based financial institutions to support the ongoing market migration to EMV in the US.

The implementation of this proven technology has provided superior performance in the field and consists of embedding and testing the SPS dual interface module into a uniquely designed card body containing an antenna EBooster® manufactured by CPI Card Group with an inline card production and personalization system. This process, adapted to large volume card issuance, ensures high reliability and production capabilities reaching 5,000 cards per hour.

“We are delighted that the combination of CPI embedding and personalization expertise with SPS EBooster® technology offers the market a unique, high performance production capability for dual interface cards with a unique stability of the card quality,” said Ivan Peytavin, Director of Sales Americas, Western Europe, Pacific for Smart Packaging Solutions (SPS).

“Our focus is to support our customers in achieving their business goals, and our ability to a deliver state-of-the-art, robust dual interface EMV product is testament to our commitment to provide industry-leading solutions to our customers in their migration to EMV in the US,” said Steve Montross, president and CEO of CPI Card Group.

The inductive coupling based EBooster® technology consists of a micro-module with contacts for EMV contact transactions integrating a small antenna, and an inlay with a full card-size antenna. Coupled with the small antenna the solution provides efficient, errorless communication in contactless mode between the card and the reader. The EBooster® technology brings a user-friendly and simplified process for dual interface cards enabling the end product to be cost effective with a high reliability.

About SPS

With more than 20 years of experience in the field of smart card technologies, Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, SPS employs 120 people. The company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at http://www.s-p-s.com.

About CPI Card group

CPI Card Group is a single source global provider of payment solutions including card production, data personalization, mobile technologies and fulfillment services. We continue to grow our business reaching card production volume in excess of 1.4 billion annually. CPI Card Group serves its customers from eight locations throughout the United States, Canada and the United Kingdom. Additionally, we have the largest network of certified high security facilities in North America. http://www.cpicardgroup.com

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Olivier BRUNET, Product & Marketing director

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