The process and cost structure is very different from the previously analyzed TI module with a packaging performed by AT&S.
(PRWEB) February 28, 2013
Rohm and TDK-EPC have joined forces to provide an alternative solution for embedded die technology. This SiP module is a second-source supply of the Texas Instruments MicroSiP™DC-DC Converter. Although fully compatible, the process and cost structure is very different from the previously analyzed TI module with a packaging performed by AT&S.
Embedded die packaging is an emerging solution to increase the integration in mobile products. This technology is supported by a game-changing, low-cost, panel-based PCB infrastructure that has the potential to create an alternative supply chain for today’s well established packaging standards.
This report provides complete teardown of the Embedded die package with: Detailed photos, Material analysis, Schematic assembly description, Manufacturing Process Flow, Cost analysis, step by step, Manufacturing cost breakdown, Selling price estimation
For further information please visit http://www.researchandmarkets.com/research/28xh72/rohm_dcdc_micro
Research and Markets
Laura Wood, Senior Manager,
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Telecommunications and Networks