Research & Markets Announces Release of 'Rohm DC/DC Micro Converter TDK-EPC Embedded Die Process Reverse Costing Analysis'

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This report provides complete teardown of the Embedded die package

The process and cost structure is very different from the previously analyzed TI module with a packaging performed by AT&S.

Rohm and TDK-EPC have joined forces to provide an alternative solution for embedded die technology. This SiP module is a second-source supply of the Texas Instruments MicroSiP™DC-DC Converter. Although fully compatible, the process and cost structure is very different from the previously analyzed TI module with a packaging performed by AT&S.

Embedded die packaging is an emerging solution to increase the integration in mobile products. This technology is supported by a game-changing, low-cost, panel-based PCB infrastructure that has the potential to create an alternative supply chain for today’s well established packaging standards.

This report provides complete teardown of the Embedded die package with: Detailed photos, Material analysis, Schematic assembly description, Manufacturing Process Flow, Cost analysis, step by step, Manufacturing cost breakdown, Selling price estimation

For further information please visit http://www.researchandmarkets.com/research/28xh72/rohm_dcdc_micro

Research and Markets
Laura Wood, Senior Manager,
press(at)researchandmarkets(dot)com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

Sector: Telecommunications and Networks

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Laura Wood
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