New High Speed Interconnect from Amphenol Aerospace Delivers Data Rates Up to 10 Gbps Per Pair

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Oval Contact System (OCS) features improved signal integrity, increased data rates and a smaller form factor as compared to industry standard quadrax.

New High Speed Interconnect from Amphenol Aerospace Delivers Data Rates Up to 10 Gbps per Pair

The high density Oval Contact System (OCS) features improved signal integrity via reduced cross talk as well as enhanced attenuation performance as compared to industry standard quadrax.

Amphenol Aerospace (NASDAQ: APH), a global leader in interconnect technologies, now offers a new high speed, rugged connector capable of delivering data rates up to 10 Gbps per pair. The high density Oval Contact System (OCS) features improved signal integrity via reduced cross talk as well as enhanced attenuation performance as compared to industry standard quadrax.

Designed for high speed applications including, but not limited to 10/40G Ethernet, HDMI/DVI video, 1/2/4/8G Fibre Channel, SATA, Serial RapidIO and PCI Express, the rugged OCS connector is ideal for use in the defense, commercial and industrial markets.

The new high density connectors come in nine insert patterns, the largest of which includes 21 differential pairs in a MIL-DTL-38999 series III shell size of 25. The connectors feature a reduced size and weight with a front release, rear removable contact system for easy repair.

The OCS meets the environmental requirements of MIL-DTL-38999 and uses off-the-shelf Mil Spec backshells. Solder cup, crimp and PCB tail termination contacts are available. Contact and plating materials are consistent with SAE-AS39029.

The OCS withstands a minimum of 500 mating cycles and features an operating temperature range of -65°C to +175°C.

For more information, please visit http://www.amphenol-aerospace.com or e-mail Sandra Ford sford(at)amphenol-aao(dot)com

High res download and full text:
http://www.simongroup.com/PressRoom/press-release.php?Job=AAO-A-25005

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READER SERVICE INQUIRIES: Please forward all reader service inquiries to Sandra Ford at Amphenol Aerospace, Amphenol Corporation, 40-60 Delaware Ave, Sidney, N.Y., 13838-1395; e-mail: sford(at)amphenol-aao(dot)com

EDITOR’S NOTE:
As one of the largest developers of interconnection technologies for the military and commercial aerospace industries, Amphenol Aerospace Operations (AAO) provides OEMs worldwide with rugged, high quality products that withstand the harshest environments.

In addition to its wide variety of connectors for specialty applications, the company offers an extensive line of standard cylindrical and rectangular, electronic, board level, fiber optic, EMI/EMP connectors as well as PCBs, backplanes, flex and rigid flex circuits and integrated systems.

AAO is headquartered in Sidney, N.Y. with other facilities located in New Hampshire, Toronto, Mexico and China. The 675,000 foot Sidney facility is home to a fully equipped material evaluation lab as well as extensive engineering resources utilizing the latest in computer aided design software and analysis tools for product testing and qualification.

AAO is a division of Amphenol Corporation, Wallingford, CT, one of the largest manufacturers of interconnect products in the world, with year 2012 sales topping $4 billion.

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Sandra Ford

Joanna Puglisi-Barley
The Simon Group, Inc.
215-453-8700 116
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