Pico Computing Joins Hybrid Memory Cube Consortium

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Company Recognized as Early Adopting Member

Pico Computing

Pico Computing, a recognized leader in hardware accelerated FPGA solutions, announced today its membership to the Hybrid Memory Cube Consortium (HMCC). Led by Micron Technology, Inc. and Samsung Electronics Co., Ltd, the HMCC is composed of many of the world’s leading technology innovators.

Over the past decade, the amount of collected data, the speed with which it is being amassed, and the complexity in analyzing information such as that held in DNA strands, has begun to overwhelm the computational resources required to process it. To keep pace, new memory resources with higher bandwidth and new processing techniques are required.

The Hybrid Memory Cube (HMC) is a highly efficient, next generation memory system designed to help accelerate computationally intensive applications. This revolutionary Integrated Circuit architecture features a base layer of logic responsible for controlling the dense stacks of vertical DRAM located above. The HMC offers shorter latencies, energy efficiency and a reduced physical form factor while dramatically increasing memory bandwidth and density.    

Pico Computing is proud to join the HMCC’s efforts in developing the Hybrid Memory Cube and to help provide higher performance solutions to these customers.

About the HMCC
Founded by leading members of the world’s semiconductor community, the Hybrid Memory Cube Consortium (HMCC) is dedicated to the development and establishment of an industry-standard interface specification for the Hybrid Memory Cube technology. Members of the consortium include Altera Corporation, ARM, HP, IBM, Micron Technology, Microsoft Corporation, Open-Silicon, Inc., Samsung Electronics Co., Ltd., SK hynix Co., and Xilinx, Inc. More than 115 prospective adopters are exploring consortium membership. To learn more about the HMCC, visit http://www.hybridmemorycube.org.

About Pico Computing
Pico Computing is the worldwide leader in architecting, developing and deploying highly integrated, modular, HPC solutions based on the use of Field Programmable Gate Array (FPGA) technologies. Pico Computing’s modular design approach brings orders-of-magnitude performance gains, greatly reduced energy costs, and a simplified application approach to such markets as cryptography, networking, bioinformatics, image processing, signal processing, simulation and scientific computing. Their approach is also highly suitable throughout the embedded computing market. In addition, Pico offers full customization and consulting services across electronic systems, hardware, software, and applications. For more information please visit http://www.picocomputing.com.

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Cheyne Okawa
Pico Computing
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