Superabrasive Leader Engis® Corporation Celebrates Anniversaries Around the World

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Engis Corporation, an early pioneer in the use of diamonds for lapping, honing, grinding and polishing applications, celebrates its 75th anniversary during 2013.

Engis Corporation, an early pioneer in the use of diamonds for lapping, honing, grinding and polishing applications, celebrates its 75th anniversary during 2013.

Engis Corporation, an early pioneer in the use of diamonds for lapping, honing, grinding and polishing applications, celebrates its 75th anniversary during 2013. Engis manufactures superabrasive finishing systems consisting of machines, tooling and consumable products. The group prides itself in not only supplying systems for fine finishing, but also the technical know-how through their Process Development Laboratories in the U.S. and Japan.

“Engis would like to thank its customers, employees, affiliates and distribution partners for working with us to establish the company as the leaders in superabrasives finishing systems,” says Stephen Griffin, president of Engis Corporation. “We earned this position by solving problems and developing custom solutions, and we will build upon this success by continuing to advance our diamond expertise and working hand-in-hand with end-users.”

    Industries served include oil and gas, electronics, semi-conductor, medical devices, aerospace, automotive, defense, ceramics, mechanical valves and seals, foundries and mold and die. Today, Engis employs approximately 220 people worldwide and remains privately held by the original founding family. Facilities include its headquarters in Wheeling, IL., (a Chicago suburb) and affiliate companies in Japan, Singapore, Hong Kong, Korea, Canada and the U.K.

Japan and Singapore
Engis Corporation founded Engis Japan in partnership with Mr. Leslie Carter in April 1983 in Yokohama, Japan. It was Engis Corporation’s first entry into the Asian market. Since that time, Engis Japan has grown into a significant contributor to the Engis Group of Companies in Asia with its design, manufacturing and customer support capabilities. Notably, it has expanded the Engis Corporation’s presence into precision lapping equipment and consumables for the LED, semi-conductor and optical markets.

    Engis Asia Pacific, based in Singapore, will celebrate its 20th anniversary in 2013. Engis Asia Pacific (EAP) was established in 1993 to support customers that were migrating from the U.S. to Southeast Asia to set-up their manufacturing facilities. EAP has been particularly active supplying high quality finishing products and systems to the hard disk drive, optical and automotive markets in the ASEAN countries (Indonesia, Malaysia, Thailand, Singapore, Philippines).

Notable Accomplishments
Originally established in Chicago in 1938 as a trading company for quality assurance instrumentation, Engis developed the industry’s first industrial diamond compound and established it under the HYPREZ® trade name. Notable accomplishments include developing a diamond lapping compound which is believed to have improved the accuracy of military aircraft guidance systems during WWII and the micronization of diamond and CBN (cubic boron nitride) powders used in the synthesis of PDC (polycrystalline diamond compact) tooling for oiling and gas drilling. Anyone who has used a portable hard drive or supermarket bar code scanner, whose optical components are lapped, has touched products shaped by Engis submicron diamond particles.

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JPG Name: Engis Corp 75th Anniversary
Caption: Engis Corporation, an early pioneer in the use of diamonds for lapping, honing, grinding and polishing applications, celebrates its 75th anniversary during 2013.

For more information, visit Engis’ Web site at http://www.Engis.com or call 800-993-6447 or +1-847-808-9400, e-mail info(at)engis(dot)com, fax +1-847-808-9403 or write to Engis Corporation, 105 West Hintz Road, Wheeling, IL., 60090.

Editorial contact: Chuck Schroeder, Insight Marketing, chucks(at)imipr(dot)com or 262-240-9790.

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