TE Connectivity Introduces Versatile, Cost-Effective M.2 (NGFF) Connectors for Smaller, Lighter and Thinner Computing Devices

Next-Generation Connector Series Leads Industry Transition from PCI Express Mini Card Connectors to M.2 (NGFF) Products

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SHANGHAI (PRWEB) May 22, 2013

TE Connectivity (TE) launched a line of M.2 next-generation form factor (NGFF) connectors, which are designed using the new interface standard for a smaller form factor in both size and volume. Engineered for a wide range of applications, including SSDs (solid state drives) and wireless cards of all types for use in notebooks, ultraportable devices, tablets, desktops and servers, TE’s M.2 (NGFF) products meet both current and future market needs for slim solutions.

TE is at the forefront of evolving markets that need miniaturized connectors to maximize printed circuit board (PCB) real estate, reduce profile height and support higher data rates. They designed two M.2 (NGFF) product types having a standard top PCB mount or a midplane (offset) PCB mount. The M.2 connectors are designed in a dense form factor of just 0.5mm pitch with 67 positions.

“As the market shifts toward slimmer solutions, we see M.2 (NGFF) products as the natural transition from the PCI Express Mini Card to a smaller, standardized form factor,” said Jaren May, global product manager of TE Consumer Devices. “As M.2 (NGFF) connectors are in the early phase of their product lifecycle, we’re working with industry standard committees, as well as other innovative companies, to lead the market towards slimmer designs.”

TE’s M.2 (NGFF) product portfolio offers industry-leading features and benefits, including:

  • Provides a range of profile heights
  • Supports enhanced data rates, which include PCI Express 3.0, SATA 3.0 and USB 3.0
  • Saves more than 20 percent of PCB real estate
  • Reduces connector height by 15 percent (as compared to PCI Express Mini Card connectors)
  • Ensures proper mating configurations with module cards through several keying options
  • Accepts both single- and double-sided modules

“Innovating a high-performing, small-scale M.2 (NGFF) connector with a cost-effective design was a challenge that our team of design engineers successfully met,” said May.

Visit TE slim solutions website for additional information, including the M.2 (NGFF) product and application specifications and 3D models, as well as customer drawings, among other resources: http://www.te.com/products/ngff-pr.

ABOUT TE CONNECTIVITY
TE Connectivity is a $13 billion world leader in connectivity. The company designs and manufactures products at the heart of electronic connections for the world’s leading industries including automotive, energy and industrial, broadband communications, consumer devices, healthcare, and aerospace and defense. TE Connectivity’s long-standing commitment to innovation and engineering excellence helps its customers solve the need for more energy efficiency, always-on communications and ever-increasing productivity. With nearly 90,000 employees in over 50 countries, TE Connectivity makes connections the world relies on to work flawlessly every day. To connect with the company, visit: http://www.TE.com.

© 2013 Tyco Electronics Shanghai Co., Ltd., a TE Connectivity Ltd. company. All Rights Reserved.
TE Connectivity and TE connectivity (logo) are trademarks.

CONTACTS:
Media Relations:
Grace Zheng
+(86)-21-33980797
grace.zheng(at)te(dot)com

Product Communications:
Jaren May
Product Manager
+(886)-2-21715233
jaren.may(at)te(dot)com


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