Milpitas, CA (PRWEB) June 03, 2013
Open-Silicon, Inc., a leading semiconductor solutions company, announced today that it will participate in two events at DAC 2013 in Austin, Texas. Joe Rash, Sr. Director of Business Development for Open-Silicon will deliver a presentation on the Hybrid Memory Cube and its role in next generation system memory at the IP Talks event in the ChipEstimate booth. Hans Bouwmeester, Sr. Director, PMO & IP for Open-Silicon, will participate in a panel discussion about the IP business model and the pitfalls and tradeoffs between buying versus building IP.
What: Presentation – “The Next Generation in System Memory – Enabling ASIC and FPGA Solutions for Hybrid Memory Cube (HMC)”
Who: Presented by Joe Rash, Sr. Director of Business Development, Open-Silicon
When: Tuesday, June 4, 11:00 AM – 11:30 AM
Where: IP Talks Stage, ChipEstimate Booth # 2446
What: Pavilion Panel – “IP Pitfalls: Avoid the Wild Ride”
Who: Hans Bouwmeester, Sr. Director, PMO & IP, Open-Silicon, along with John Swanson of Synopsys, Inc. and Keith Odom of National Instruments Corp., and moderated by Warren Savage of IPextreme.
When: Wednesday, June 5, 10:30 AM – 11:15 AM
Where: Booth 509
About Open-Silicon, Inc.
Open-Silicon, a leading supplier and developer of customer-specific products (CSPs), provides ASICs, platforms, concept-to-parts development, customized IP, low-effort derivative design, and state-of-the-art manufacturing solutions. With Open-Silicon, customer’s benefit from global engineering including an ARM® Technology Center of Excellence, advanced SerDes integration, 2.5D interposer-based package engineering, experienced architects, leading-edge physical design methodology, and embedded software development, all leveraging the industry’s best technology from both Open-Silicon and the open market. For more information, visit Open-Silicon’s website at http://www.open-silicon.com or call 408-240-5700.