Topics will span current technical issues, emerging technologies and future trends, and give authors the opportunity to present research findings on the emerging technical challenges facing the industry to a large international audience of their peers.
Bellingham, Washington (PRWEB) June 18, 2013
A new look at “big glass” and visionary perspectives on complex materials, costs and other trends will highlight technical sessions at SPIE Photomask Technology 2013 in Monterey, California this fall. In its 33rd year, the three-day event is the industry’s largest mask meeting and includes an exhibition of key suppliers, approximately 100 technical presentations and numerous networking lunches and receptions. Sponsored by SPIE, the international society for optics and photonics, the meeting will be held at the Monterey Conference Center and Monterey Marriott, 10-12 September.
“This annual meeting continues to be the premier worldwide technical meeting for the photomask industry and provides a condensed and up-to-date overview of trends and best practices,” said 2013 Symposium Chair Thomas Faure (IBM Corp.). “Session topics will span current technical issues, emerging technologies and future trends and give authors the opportunity to present research findings on the emerging technical challenges facing the industry to a large international audience of their peers.”
Among sessions “not to be missed,” Faure said, is the opening keynote talk by Michael Mayberry, Corporate VP of the Technology and Manufacturing Group and Director of Components Research at Intel Corp. Mayberry will survey the complex issues including materials, functional compatibility, performance-power metrics and cost needing to be solved to meet needs of the future.
Sessions will cover topics such as OPC/simulation, mask contamination and long-term durability, and one-beam direct write. With EUV masks now part of the mainstream of mask technology, all individual mask-related tasks of EUV will be covered.
Symposium co-chair Paul Ackmann (GLOBALFOUNDRIES Inc.) will lead the final day’s panel discussion on "Big bad glass: Will nine-inch glass return?" The panel will address questions such as whether changes in the wafer landscape require the move to larger glass, what the cost of not doing so would be and whether another technique would support the technology. Panelists will include:
- Donis Flagello, Nikon Research Corp. of America
- Janice Golda, Intel Corp.
- Brian Grenon, RAVE LLC
- Franklin Kalk, Toppan Photomasks, Inc.
- Harry Levinson, GLOBALFOUNDRIES Inc.
- Daniel Wack, KLA-Tencor Corp.
The exhibition will run Tuesday and Wednesday during the event and feature companies including Carl Zeiss, Gudeng, Ibss Group, Inko Industrial Corp., Micro Lithography, Mitsui Chemicals America, Nippon Control System Corp., Solid State Technology (PennWell Corp.), Pozzetta, RAVE LLC, Shin-Etsu Micro Si, Synopsys, XYALIS and Zeeko.
For the first time, meeting attendees will have free 90-day access to conference proceedings in the SPIE Digital Library beginning during the event, in addition to a full-conference proceedings on CD. Proceedings are published online as manuscripts are approved, with CD publication when all manuscripts are in.
SPIE is the international society for optics and photonics, a not-for-profit organization founded in 1955 to advance light-based technologies. The Society serves more than 235,000 constituents from approximately 155 countries, offering conferences, continuing education, books, journals, and a digital library in support of interdisciplinary information exchange, professional networking, and patent precedent. SPIE provided over $3.2 million in support of education and outreach programs in 2012.