AIM to Feature New Low-Cost Lead-Free Solder Paste and VOC-Free Liquid Flux at SMTAI, Oct. 15-16th, 2013

AIM, a leading global manufacturer of assembly materials for the electronics industry, to feature new NC259 Solder Paste and NC277 Liquid Flux at the 2013 SMTA International Expo, October 15th – 16th at the Fort Worth Convention Center in Fort Worth, Texas.

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Visit Us in Booth No. 307 at SMTAI October 15-16th

Cranston, Rhode Island (PRWEB) September 15, 2013

AIM Solder, a leading global manufacturer of assembly materials for the electronics industry, will highlight their new NC259 Solder Paste and NC277 Liquid Flux at the 2013 SMTA International Expo, October 15th – 16th at the Fort Worth Convention Center in Fort Worth, Texas.

NC259 is a low-cost, lead-free and halogen-free solder paste that offers the performance of tin/lead and high-silver, lead-free solder pastes minimizing post-process residue and graping. Proven to mitigate head-in-pillow defects, NC259 reduces rework and rejected board costs allowing manufacturers to attain the SMT soldering results they require while paying significantly less per gram than with traditional lead-free solder pastes. NC259 is formulated to provide one of the longest pause-to-print windows in the industry, resulting in less solder waste, fewer restart costs and improved overall quality of prints.

NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux that is suitable for long thermal demands. This flux can withstand the high thermal preheats and provides a broad activation range, proving to be an excellent flux for a variety of process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys. In addition, NC277 offers medium post-process residues and has shown to reduce preventative maintenance requirements for spray fluxing applications.

Additionally, Karl Seelig, AIM’s Vice President of Technology, will be presenting “Alternative Lead-Free Alloys for SMT Assembly” at the SMTA International Technical Conference. The presentation is scheduled on Wednesday, October 16th during session MFX5: Alloy Selection and its Influence on Electronic Assembly 10:30 am – 12:30 pm in Room 202D of the Fort Worth Convention Center.

To discover all of AIM’s products and services, including lead-free and halogen-free solder products and SN100C, visit the company at booth no. 307 at SMTAI this October.

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.

For more information about AIM, visit AIMsolder.com.

Upcoming Events:
October 9, 2013 - SMTA Long Island Islandia Marriott Long Island, Islandia, NY USA    
October 15-16, 2013 – SMTA International Fort Worth Convention Center, Fort Worth, TX USA
October 22, 2013 - SMTA Connecticut Chapter Waterbury Marriott, CT USA    
November 12-15, 2013 – Productronica Messe München, Munich, Germany


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