Carsem Achieves AEC-Q100 Grade 0 Automotive Qualification for Elmos

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has achieved the stringent AEC-Q100 Grade 0 Automotive requirement for Elmos Semiconductor AG using Copper Wire in wide body leaded package.

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Ipoh, Malaysia (PRWEB) April 10, 2014

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has achieved the stringent AEC-Q100 Grade 0 Automotive requirement for Elmos Semiconductor AG using Copper Wire in wide body leaded package. Elmos is capable of supplying devices with copper wire bonding for automotive applications.

Mr.Albert Law, Carsem’s VP WW Sales & Marketing stated, "AECQ100 is a significant quality landmark with Automotive manufacturers. This Achievement is outstanding for us as it identifies Carsem as a key supplier for high quality Copper Wire solutions in standard IC packaging, offering a robust, temperature critical, cost effective solution for demanding requirements of the Automotive market."

Carsem achieved customer qualification in copper wire bonding since 2007 and has been in production since 2008. In fact, millions of these products have already been shipped. Requirements for the automotive market are much higher but by optimising the wafer process, wire bonding settings and materials in assembly, it was possible to achieve the high automotive quality.

Carsem’s copper wirebond capability ranges from the low pin count micro packages to high pin count MLP packages with a variety of metallization types and wires sizes.

Carsem is proud to claim the lead in the Copper wire bonding process with particular emphasis on materials, equipment and process controls needed to achieve consistency in process capability, quality and yields.

About Carsem

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes many advanced technologies, such as the Micro Leadframe Package (MLP), Flip Chip on Leadframe (FCOL™), an SiP (System-in-Package) Technology, Cavity-Package Motion and Pressure Sensor technologies as well as stacked-die capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949, ANSI-ESD S20.20 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK, China, Malaysia and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.


Contact

  • Albert Law - VP of World Wide Sales and Marketing
    Carsem
    +60 6053123333 Ext: 0
    Email