Heidelberg, Baden-Württemberg (PRWEB) April 18, 2014
Heidelberg Instruments, GmbH, a leading supplier of maskless aligner and laser lithography systems, announced order for a VPG 200 advanced maskless aligner system from the MicroNanoTechnology (CMi) Center at EPFL, Switzerland.
The VPG 200 introduces Heidelberg Instruments’ most advanced small and midsize Maskless Aligner Systems currently available on the market. Because of the high exposure speed, the VPG 200 can be used as a Maskless Aligner for direct exposure on wafers or any other flat substrates coated with photosensitive material. As an example, a 4” wafer can be patterned in less than 2 minutes, eliminating the need for photomasks and mask aligner tools. Systems can be used in a variety of demanding fields that require microstructures. Typical applications include MEMS, Advanced Packaging, 3D Integration, LED production, Life Sciences, and Compound Semiconductor.
According to Philippe Flückiger, Director of Operations at EPFL Center of MicroNanoTechnology (CMi), “The VPG 200 manufactured by Heidelberg Instruments Mikrotechnik GmbH will bring to CMi the high end performance Direct Laser Write capability that is really needed. Its stable, reproducible results and its process flexibility are a great match to the needs of our users. The equipment will be dedicated to state-of-the-art research in micro and nano fabrication. The CMi is a user based micro/nano fabrication facility that provides centralized cleanroom facilities for the all faculties of EPFL and is also accessed by local industry. We have more than 400 active users at any one time”.