Samtec Brings FireFly™ System Demonstration and More to OFC 2016

Share Article

Samtec will be exhibiting and demonstrating many of their interconnect and design solutions at OFC 2016, including the FireFly™ system.

News Image
The Samtec Microelectronics Group has an extensive offering of advanced IC packaging and assembly capabilities, as well as the ability to assist in choosing the best technology and materials for a specific application.

Samtec is excited to announce that they will be exhibiting at OFC, March 20-24th, with a focus on mid-board and panel optical systems. Samtec’s optical and signal integrity expertise enables systems designs with maximum density, minimal cost and performance optimization, while offering a path to 56 Gbps and beyond.

Of several products being featured at OFC this year, the FireFly™ system, which enables chip-to-chip, board-to-board and system-to-system connectivity at data rates up to 28 Gbps, is a must-see. FireFly™ is based on a high performance, high density interconnect system which gives the designer the flexibility of using micro footprint optical and lower-cost copper interconnects interchangeably with the same connector system. There’s also the new FQSFP Series, which is a flyover QSFP assembly that improves signal integrity by flying critical data over lossy PCB materials, thus providing more flexibility in the system architecture.

“At OFC, we will highlight our advanced IC packaging capabilities, through Samtec Microelectronics. The Samtec Microelectronics Group has an extensive offering of advanced IC packaging and assembly capabilities, as well as the ability to assist in choosing the best technology and materials for a specific application,” Glenn Dixon, Sales Manager at Samtec, said. “Samtec Microelectronics specializes in miniaturizing electronic products and technologies, scaling chips and packaging and integrating more electrical and optical functions into a smaller form factor.”

Samtec will have two demonstrations running at their booth. The first is a system level demonstration of high speed signal transfer rates at 28Gbps, FireFly™ high speed optical links at 28 Gbps, and signal quality performance of ExaMAX® backplane connector. The second is a demonstration of a FireFly™ 14 Gbps optical link in a FMC VITA 57.1 form factor for FPGA applications for the high performance computing, rugged military, and industrial markets, to name a few.

To check out the demonstrations and learn more about Samtec, stop by booth #2367 at OFC, March 20-24th. For additional event information, please visit https://blog.samtec.com/event/ofc-show/.

About Samtec, Inc.
Founded in 1976 and headquartered in New Albany, IN, Samtec, Inc. is a privately held, debt-free $625 million global manufacturer of a broad line of electronic interconnect solutions, including IC-to-Board/Ultra Micro, High Speed Board-to-Board, High Speed Cables, Future-Proof/Active Optics, Flexible Stacking, and Micro/Rugged components and cables. To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between. With 33 locations in 18 different countries, including manufacturing facilities in New Albany, Colorado, Oregon, Costa Rica, China, Malaysia and Singapore, Samtec’s global presence enables its unmatched customer service.

Samtec, Inc.,
P.O. Box 1147
New Albany, IN 47151-1147
USA
Phone: 1-800-SAMTEC-9 (800-726-8329)
http://www.samtec.com

Share article on social media or email:

View article via:

Pdf Print

Contact Author

Hailey Heishman
Samtec
+1 5027441574
Email >
@SamtecInc
Follow >
Samtec
Like >
Samtec Inc

Visit website