ADLINK Debuts Value Line of Fanless Embedded Computers with 6th Gen Intel® Core™ Processor-based MVP-6000

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Price point combines with features and performance to empower industrial automation applications

Value Series 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer

Value Series 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer

The MVP-6000 delivers the perfect combination of features and performance in a compact package without sacrificing the benefits of fanless construction, all at a significantly competitive price while still guaranteeing a high level of performance.

ADLINK Technology, Inc., a leading global provider of intelligent computing platforms, has announced the release of the MVP-6000 Series, the first in its new value line of fanless embedded computing platforms. The MVP-6000 Series revolutionizes conventional industrial PC concepts, providing a perfect combination of features and performance in a compact size at an unprecedented price point. Incorporating the 6th Generation Intel® Core™ processor, the MVP-6000 features superior computing performance, boosted by up to 30% over previous generation CPUs. Integrating ADLINK’s proven fanless construction, as featured in its Matrix product line, the MVP-6000 overcomes the challenges of harsh environments, delivering invaluable benefits to any industrial automation operation.

PCIe x16 and PCI slots optimize expansion capability, with single-side I/O access benefit practically any industrial automation application, with a special suitability for those in need of a rugged and compact platform with comprehensive I/O coverage. In addition, integration of ADLINK’s complete range of fully pre-verified motion, vision and I/O cards guarantees maximum compatibility and convenience in the most demanding industrial applications.

"Our customers have been looking for a complete solution to their industrial automation demands. ADLINK’s introduction of the MVP-6000 provides them with a unique choice, delivering the perfect combination of features and performance in a compact package without sacrificing the benefits of fanless construction, all at a significantly competitive price while still guaranteeing a level of performance not available in any other IPC in this class," said Kenny Chang, Director of the I/O Platform Center at ADLINK Technology.

The MVP-6000 Series provides dual-channel DDR4 SO-DIMM sockets for up to 32 GB of memory, and the Intel® HD Graphics 530 supercharges graphics performance. Dual independent displays are fully supported, with 1 VGA, 1 DVI and 2 DisplayPorts, 2 software-programmable RS-232/422/485 + 2 RS-232 ports, 3 Intel® GbE ports with teaming function, 6 external USB ports (4 USB 3.0 +2 USB 2.0), and 8CH DI and 8CH DO. Rigorous testing for operational verification assures the line’s reliability and ruggedness, both critical for complete functionality when facing the rigors of demanding industrial application environments. Along with a versatile I/O array and flexible expansion capacity, the MVP-6000 Series fully satisfies all the needs of industrial automation with performance demanded by vision inspection and motion control applications.

Learn more about Fanless Embedded Computer Products

For more information on ADLINK, please visit http://www.adlinktech.com.

About ADLINK

ADLINK Technology is enabling the Internet of Things (IoT) with innovative embedded computing solutions for edge devices, intelligent gateways and cloud services. ADLINK's products are application-ready for industrial automation, communications, medical, defense, transportation, and infotainment industries. Our product range includes motherboards, blades, chassis, modules, and systems based on industry standard form factors, as well as an extensive line of test & measurement products, smart touch computers, displays and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged™, supporting extended operating temperature ranges, and MIL-STD levels of shock and vibration.

ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations, including the PCI Industrial Computer Manufacturers Group (PICMG), the PXI Systems Alliance (PXISA), and the Standardization Group for Embedded Technologies (SGET).

ADLINK is a global company with headquarters in Taiwan; manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).

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Bourke MacDonald
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