Santa Clara, CA (PRWEB) July 05, 2016
A global leader in Integrated Passives, OnChip Devices today announced their onshore backend wafer processing. These services include Silicon wafer back-lap, various back-metal schemes, a wide range of wafer sort/test capabilities, sawing, die pick-and-place into waffle packs or gel packs, and final visual inspection.
Backgrinding, lapping, or mechanical polishing are methods used to reduce thickness of wafers to attain a desired size (down to 100 microns or 4 mils) or surface texture (ultra fine finish of 2000-Grit). Proper backside surface finish is key to remove native oxide growth and ensure ideal back-metal adhesion. Our machines are capable of processing wafers ranging in size from 100 mm (4”) to 200 mm (8”). Standard lead-times are between 24-48 hours.
OnChip’s systems deposit ultra-clean metal and dielectric films in a class-100 cleanroom. Generally, an in-situ RF etch is performed prior to sequential deposition of multilayers to insure good film adhesion and ohmic contact to underlying conductive layers or to the bare silicon. The most common metal stack consists of sputter deposited Titanium (500 Angstroms) followed by Nickel (3,000 Angstroms), and finally a flash of Gold (200 Angstroms). All sputter films are currently available on silicon wafer sizes up to 150 mm (6”) in diameter. Larger wafer sizes may be considered on a case-by-case basis.
OnChip can process high volume while promising to deliver short lead-times and cut-rate (or competitive) prices. We offer both wafer probe (including bumped wafer probe) and final test. Our fully automatic wafer probers are capable of processing wafers up to 200 mm (8”). A wide range of automated test equipment allows for testing of analog, digital, mixed-signal and RF technologies with probers and handlers to support both wafer sort and package test. Multi-site wafer probing at hot temperature (up to 200°C) is available.
OnChip’s dicing machines are capable of processing fragments and partial wafers to 200 mm (8”) silicon wafers. Additionally, other materials such as Gallium Arsenide, Micro-Electro-Mechanical systems (MEMS), and LEDs can also be processed. Dicing precision of less than 2 microns and kerf of less than 16 microns can be achieved.
OnChip offers both automated and manual loading of parts. Automated pick-and-place of die into packages including but not limited to gel packs and waffle packs. Manual pick-and-place via vacuum pen can also be requested for parts that are unpassivated, sensitive (moisture sensitive devices), MEMS, or require topside handling.
Semiconductor ICs (Integrated Circuits) are extremely fragile and endure a variety of stresses during wafer fabrication, testing, and dicing. They are easily prone to defects that would either prevent the device from operating correctly or pose a reliability concern for long-term operation. These defects are caused either during wafer fabrication or mechanically-induced during handling. OnChip has established capabilities to offer 100% visual inspection using both low and high power microscopes that meet Commercial, Military, and Medical Electronics specifications. Inspection is done to look for various types of visual defects. Some of the more common defects include:
- Embedded foreign material
- Metallization or Passivation voids & irregularities
- Contamination such as liquid or adhesive residues and surface particles
- Surface scratches caused by test probes or wafer handlers
- Dicing defects such as chip outs and cracks
Availability and Pricing
All services are available immediately. These services are performed at OnChip Devices’ Santa Clara facility and are produced to the highest quality standards. Please contact email@example.com for a quote or additional information.
About OnChip Devices
OnChip Devices is headquartered in Santa Clara, CA and is a global leader in Integrated Passive Devices. With its own silicon fabrication facility and strong partnerships with full turnkey assembly and test houses in USA & Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High Brightness LED, Computing, and Consumer Electronics.