ADLINK Announces its First COM Express® 3.0 Type 7 Computer-on-Module

Share Article

New Type 7 pinout brings server grade performance to industry's leading module standard for high performance applications such as data communication

ADLINK's COM Express 3.0 Type 7 Express-BD7 Computer-on-Module

ADLINK's COM Express 3.0 Type 7 Express-BD7 Computer-on-Module

ADLINK has worked closely with fellow PICMG members to develop this latest module specification and pinout to leverage a new type of low power, server-level silicon that appeared on the market at the end of 2015.

ADLINK Technology, Inc., a leading global provider of Industrial Internet of Things (IIoT) and communications platforms, announced its first computer-on-module (COM) based on the latest PCI Industrial Computer Manufacturers Group (PICMG®) COM Express® 3.0 specification with new Type 7 pinout, for which ADLINK lead development efforts to bring a server-grade platform and 10 Gigabit Ethernet (GbE) capabilities to a COM form factor. ADLINK’s Express-BD7 targets customers building space-constrained systems in industrial automation and data communication, such as virtualization, edge computing or other numerical applications, that require high density CPU cores balanced by reasonable power consumption.

The COM Express standard’s new Type 7 pinout, as compared to the Type 6 pinout, does away with all graphics support and replaces it with up to four 10GbE ports and an additional eight PCIe ports, bringing the total PCIe support to up to 32 PCIe lanes. The Type 7 pinout has been specifically tailored to leverage all the functions of low power, headless server-grade SoCs with a TDP below 65 Watts. The Intel® Xeon® SoCs featured in ADLINK’s Express-BD7 support up to 16 CPU processor cores, 32 PCIe lanes, and multiple 10GbE ports. In addition, the Type 7 pinout brings out 10GBase-KR signals, meaning the carrier board designer can choose between KR-to-KR, KR-to-optical fiber or KR-to-copper. A Network Controller Sideband Interface (NC-SI) bus is also supported, allowing for Intelligent Platform Management Interface (IPMI) Board Management Controller (BMC) support on the carrier board.

ADLINK is playing a leading role in the PICMG subcommittee that is currently defining the new COM Express 3.0 specification. The committee, which started its work in late 2015, is chaired by ADLINK's Jeff Munch, CTO of Americas, and has just published a preview of the new specification. The preview defines the new Type 7 pinout and allows module manufacturers and customers to start designs before the full specifications are published, which is expected to be the end of Q3 2016.

“ADLINK has worked closely with fellow PICMG members to develop this latest module specification and pinout to leverage a new type of low power, server-level silicon that appeared on the market at the end of 2015. Type 7 is tailor-made to accommodate these low power, server-oriented SoCs. In addition to the obvious use case in 10GbE data communication, we see many others application areas for these products, such as virtualization, real-time control and even graphics applications using discrete GPU solutions over PCIe x16, " said Alex Wang, product manager for COM Express modules at ADLINK. “Our COM Express Type 7 roadmap focuses on creating products with advanced computing performance and multi-core capabilities. Our COM Express products are off-the-shelf building blocks that allow our customers to focus on adding value to their carrier boards, reducing their total cost-of-ownership and expediting their time-to-market.”  

ADLINK’s Express-BD7 provides up to 32GB dual channel DDR4 at 1867/2133/2400MHz ECC (dependent on SoC SKU), up to eight PCIe x1 (Gen2), two PCIe x4, one PCIe x16 (Gen3), two SATA 6 Gb/s and four USB 3.0/2.0. The module comes with a build option for an Extreme Rugged operating temperature range of -40°C to +85°C and supports ADLINK Smart Embedded Management Agent (SEMA®), which enables remote management and control of distributed devices.

ADLINK's SEMA-equipped devices connect seamlessly to our SEMA Cloud® solution to enable remote monitoring, autonomous status analysis, custom data collection, and initiation of appropriate actions. All collected data, including sensor measurements and management commands, are available from any place, at any time via encrypted data connection.

For more information on the new PICMG COM Express® 3.0 specification and Type 7 pinout, download our technical article. For more information on the Express-BD7, please visit

ADLINK Technology is enabling the Internet of Things (IoT) with innovative embedded computing solutions for edge devices, intelligent gateways and cloud services. ADLINK’s products are application-ready for industrial automation, communications, medical, defense, transportation, and infotainment industries. Our product range includes motherboards, blades, chassis, modules, and systems based on industry standard form factors, as well as an extensive line of test & measurement products and Smart Touch Computers, displays and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged, supporting extended temperature ranges, shock and vibration.

ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations, including PCI Industrial Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), and Standardization Group for Embedded Technologies (SGeT).

ADLINK is a global company with headquarters in Taiwan and manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166). For more information, please visit


Intel and Xeon are registered trademarks of Intel® Corporation in the United States and other countries. All other trademarks are the property of their respective owner.

Share article on social media or email:

View article via:

Pdf Print

Contact Author

Bourke MacDonald
Visit website