We're thrilled to launch the "Google News" of 3D-ICs
San Jose, California (PRWEB) September 29, 2011
With the semiconductor industry’s transition to 3D-ICs gaining momentum, online resources focused on the subject continue to emerge. Last week, 3D-ICs.com, a web portal that automatically mines the internet for news, blogs and technical publications related to 3D-ICs was launched, joining the well-regarded 3D InCites in the effort to promote 3D-IC adoption. Francoise von Trapp, Editorial Director and Founder of 3D InCites, will also assume the title of Editorial Director for 3D-ICs.com.
3D chips are seen as an important growth area for the semiconductor industry. Yole Developpement, an analyst firm, recently projected that the market for 3D TSV packaging will increase from $325M in 2009 to $4.1B in 2015, a cumulative annual growth rate (CAGR) of 53%. This compares with a projected CAGR of 7.7% for the overall semiconductor packaging industry. In addition, players in the memory industry, such as Toshiba, Samsung, Micron and Hynix, are actively exploring monolithic 3D approaches to NAND flash memory, with risk production scheduled to begin in the next 3 years. Interest in the field is high due to these reasons.
3D-ICs.com, dubbed the “Google News of 3D” by its organizers, uses sophisticated software algorithms to search and list the best news, blogs and publications related to the field. All aspects of 3D-ICs are covered, including process technologies, design and architecture issues, packaging as well as industry news. Links are provided to news and blog posts appearing in the popular press as well as in industry portals such as EETimes, Solid State Technology, EDN, Chip Scale Review, Fabtech and Future-Fab International.
von Trapp, a well-known journalist and blogger in the semiconductor industry, says she’s thrilled to take on this new endeavor. Dubbed the "Queen of 3D" because of her editorial focus on the emerging 3D integration technologies, von Trapp founded 3D InCites in 2009 to stir up interest in 3D-IC integration and packaging technologies. She is also Sr. technical editor of Chip Scale Review magazine, a leading publication in the semiconductor packaging industry.
“I see many synergies between 3D InCites and 3D-ICs.com, and think that the two communities will benefit from collaboration,” notes von Trapp. “While 3D-ICs.com aggregates news from a number of reliable sources, 3D InCites provides in-depth reporting, a forum for comment and discussion, and a venue for suppliers in the 3D space to promote their tools, materials, and processes. Together, the sites provide a full complement of 3D integration information to industry enthusiasts. I’d like to thank MonolithIC 3D Inc. for sponsoring this activity.”
3D InCites boasts over 440 registered members from around the world, and averages 1500 unique visitors monthly. Companies represented include Maxim, ST Microelectronics, Cadence, Amkor, Powertech, ASE, Micron, Medtronic, SPIL, Texas Instruments, Tessera, Infineon, STATS Chip PAC, Applied Materials, Synopsys, SanDisk, Tezzaron, and dozens more. Through this close collaboration, 3D-ICs.com will be able to leverage this already established community while also building a following of its own.