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BEST Launches EZReball(TM) Stencil

BEST Inc, announces the launch of its patent-pending EZReball™ solder ball preform.

Rolling Meadows, IL (PRWEB) November 14, 2007 -- BEST Inc, announces the launch of its patent-pending EZReball™ solder ball preform. This unique preform and reballing method simplifies the reballing process allowing for better yields and faster reballing times. The reballing of devices has become increasingly common as the switch to lead-free devices has made some devices unavailable in either tin-lead or lead free versions.

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The simple nature of the EZReball™ reballing process allows even the beginner repair technician to reliably and quickly replace solder balls on a BGA device. Alignment is simple with the edges of the perform being "squared up" with the sides of the package thereby eliminating the need to purchase expensive custom frames or fixtures. The adhesive is engineered such that the balls are firmly held in place until after reflow is achieved thereby reducing the problem of missing solder balls found in other techniques. After the device has been reflowed, the EZReball™ stencil is simply peeled off, eliminating the time required in cleaning off residual paper used in other methods.

BEST EZReball™ preforms are packaged in quantities of 15 and delivered in 5 business days. EZReball™ stencils are custom made to your exact alloy including tin-lead and lead-free alloys and device array requirements without tooling charges.

About Business Electronics Soldering Technologies (BEST)
Headquartered in Rolling Meadows, Illinois BEST is a supplier of PCB rework and repair services serving communications, computer, industrial, automotive, avionic and military accounts. In addition BEST is a master IPC-certified training center certifying students and instructors in J-STD-001, IPC-610 and IPC 7711 and 7721 material.

www.solder.net

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CONTACT INFORMATION
Bob Wettermann
B.E.S.T. Incorporated
847-797-9250
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