Carsem Expands Extremely Thin MLP Capacity at Suzhou Factory

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Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are significantly expanding their Suzhou, China factory’s manufacturing capacity for the new X3 package.

Since we announced the X3 package in October last year, the level of interest by our customers has grown dramatically and we are quickly expanding the capacity to meet the increased demand.

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are significantly expanding their Suzhou, China factory’s manufacturing capacity for the new X3 package. The X3 is an extremely thin version of the MLP (Micro Leadframe Package) that is a two lead package with nominal dimensions of 0.6 mm long by 0.3 mm wide and 0.3 mm thick, which is very similar in size to a 0201 surface mount component.

Carsem began shipping pilot production volumes of the X3 package in March this year and by Q3 this year they will have the capacity to produce over one million parts per day. It is expected that 100% of the production will be full turn-key manufacturing services that include electrical testing, laser mark and tape-and-reel.

Mr. Rick Flowers, Carsem’s V.P. of World Wide Sales and Marketing stated, “Since we announced the X3 package in October last year, the level of interest by our customers has grown dramatically and we are quickly expanding the capacity to meet the increased demand.” Mr. Flowers further stated, “Longer term, we expect to add this capability to our factory in Malaysia as well.”

Anyone interested in further details about this new package should contact your local Carsem sales office, which can be found on the Carsem web site at http://www.carsem.com.

About Carsem:
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com .

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Rick Flowers
Carsem
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