The EcoVision 4000 pad is representative of this shift towards application specific pads. Throughout our entire VisionPad platform, we provide customers with the best and most cost effective solutions for their specific CMP process requirements.
PHOENIX & HSINCHU, Taiwan (PRWEB) September 12, 2007
"As customers switch to advanced processes and nodes, we offer products designed for their specific polishing needs," explained Cathie Markham, vice president of technology for Rohm and Haas Electronic Materials, CMP Technologies. "The EcoVision 4000 pad is representative of this shift towards application specific pads. Throughout our entire VisionPad platform, we provide customers with the best and most cost effective solutions for their specific CMP process requirements."
The EcoVision 4000 CMP pad features a unique design and chemistry allowing customers to achieve a significant reduction in cost of ownership with highly consistent performance over the product's lifetime. The lifetime of the EcoVision 4000 pad demonstrates a significant improvement over existing soft pads for copper barrier applications and is comparable to hard pads such as the industry-standard IC1000(TM) pad, used for bulk copper removal CMP applications. This allows users to change the pads on all platens at the same time, minimizing the costs associated with downtime and qualification processes.
The pad's innovative manufacturing process produces a surface that results in increased contact area between the pad and the wafer. This reduces defects and improves die yields by minimizing scratches and chatter marks across the wafer resulting in best-of-class defectivity performance. Unlike soft pads, the EcoVision 4000 pad is conditioned, allowing for pad surface regeneration to achieve optimal polishing results that are consistent throughout the pad's life as well as from pad to pad.
The EcoVision 4000 pad is currently available for customer sampling in multiple product configurations, and will be available commercially in Q4 of this year. The product will be featured at SEMICON Taiwan from September 12-14 in Hall 1 Booth 1252.
About Rohm and Haas Electronic Materials
Rohm and Haas Electronic Materials develops and delivers innovative material solutions and processes to the electronic and optoelectronic industries. Focused on the circuit board, semiconductor manufacturing, advanced packaging, and flat panel display industries, its products and technologies are integral elements in electronic devices around the world.
The CMP Technologies business has been a leader and innovator in polishing technology for the global semiconductor industry since 1969. CMP Technologies products include polishing pads, conditioners and slurries. CMP Technologies maintains operations throughout the world, including manufacturing facilities in Newark, Delaware, Hsinchu, Taiwan and in the Mie and Kyoto prefectures in Japan. Additional information is available at http://www.rohmhaas.com.
About Rohm and Haas Company
Leading the way since 1909, Rohm and Haas (NYSE:ROH) is a global pioneer in the creation and development of innovative technologies and solutions for the specialty materials industry. The company's technologies are found in a wide range of markets including: Building and Construction, Electronics, Food and Retail, Household and Personal Care, Industrial Process, Packaging, Paper, Transportation and Water. Our innovative technologies and solutions help to improve life everyday, around the world. Based in Philadelphia, PA, the company generated annual sales of approximately $8.2 billion in 2006. Visit http://www.rohmhaas.com for more information. Imagine the possibilities(TM).