San Jose, California (PRWEB) February 28, 2008
In the wake of growing sophistication and functionality of a variety of electronics systems, thermal management has assumed an important role in the management of costs associated with product development and time required for market release. Today's printed circuit boards (PCBs) need efficient thermal management solutions such as thermoelectric coolers and heat sinks to control the rising power densities. Excessive heat affects the performance of electronic products in broad range of industries. In several cases, failures in electronic products happen on account of excessive heat. The growing consumer preference for mobile devices results in greater heat dissipation problems in electronic systems owing to the increase in the use of advanced computer chips, smaller form factors, superior system integration and complex power needs.
With developments in technology and marked increase in the production of miniaturized microprocessors, the demand for electronic thermal management devices are on the increase. The miniature size of the processor and the enhanced power levels generate high levels of heat and devices are required to moderate this and to cool heat generation. Electronic thermal management devices perform this job and cool the electronic components and the system from excessive heat during operation. Electronic thermal management devices are likely to command a premium market in the coming years for their effective use in PCs, telecommunication systems and servers. Also, the demand is likely to receive boost with system integrators and original equipment manufacturers (OEMs) integrating more components on PCBs. Nevertheless, market growth is likely to be restricted with the system-on-chip design complexities.
Global electronic thermal management market is projected to experience healthy growth and reach US$5.8 billion by 2010, as stated by Global Industry Analysts, Inc. United States represents the largest market, accounting for 30% of the global demand. Japan, Europe, and Asia-Pacific represent the other leading markets. In terms of end-use segments, computers represents the largest one, consuming an estimated US$2.0 billion worth of electronic thermal management products in 2007. Medical/office equipment represents the fastest growing end-use segment for electronic thermal management, at 15.4% CAGR. In terms of product segments, electronic thermal management hardware overwhelmingly dominates the global electronic thermal management market, with an estimated 80% share or US$3.7 billion, in 2007. Electronic thermal management software represents the fastest growing segment, with a projected CAGR of nearly 10% over the next five years.
Leading players in the global electronic thermal management market include II-VI Incorporated, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Alcoa, Inc., Alpha Metals, Alpha Technologies Group, Inc., Ametek, Inc., Amkor Technology, Inc., Ansoft Corporation, Fluent, Inc., ASAT Holdings Ltd., Brush Engineered Materials, Inc., CTS Corporation, Comair Rotron, Inc., Ceramics Process Systems Corporation, Chomerics, Cool Innovations, Inc., Cooler Master Co., Ltd., Daat Research Corp., Degree Controls, Inc., Dow Corning Corporation, Dynatron Corporation, Enertron, Inc., Flomerics, Fujikura Ltd., Henkel Loctite Corporation, Honeywell Electronic Materials, Isonics Corporation, Intricast Company Inc, ITW Vortec, JARO Components, Inc., Kooltronic, Inc., Kyocera Corporation, Laird Technologies, Liebert Corporation, Lord Corporation, Lytron Incorporated, Mathis Instruments Ltd, Melcor Corporation, Metal Matrix Cast Composites, LLC, Micronel U.S., Netzsch Instruments, Inc., Netzsch Thermal Analysis, NMB Technologies Corporation, Noren Products, Inc., Orient Semiconductor Electronics Ltd., PC Power & Cooling, Inc., Pfannenberg, Inc., PLANSEE Thermal Management Solutions, R-Theta Thermal Solutions, Inc., Sumitomo Electric Industries, Ltd., Tech Spray, L. P., Tellurex Corp., The Bergquist Company, The Filter Factory, Inc., Thermacore, Transene Company, Inc., Tennmax United, U.S. Toyo Fan Corporation, United Thermal Engineering Corporation, Vette Corp., and Wakefield Thermal Solutions, Inc.
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