Dallas, Texas (PRWEB) April 14, 2013
Over the next five years, an incredible 3x wafer growth is expected for the Flip-Chip platform, which will reach 40M+ of 12’’eq wspy by 2018!
Despite its high 19% CAGR, Flip-chip is not new -- in fact, it was first introduced by IBM over 30 years ago! As such, it would be easy to consider it an old, uninteresting, mature technology. But this is far from true! Instead, Flip-Chip is keeping up with the times and developing new bumping solutions to serve the most advanced technologies, like 3DIC and 2.5D. Indeed, no matter what packaging technology you're using, a bumping step is always required at the end!
In 2012, bumping technologies accounted for 81% of the total installed capacity in the middle-end area. That's big, that it represents 14M+ 12’’eq wafers (2012 installed capacity: see figure below) -- and fab loading rates are high as well, especially for the Cu pillar platform (88%). Flip-Chip is also big on value: in 2012 it was a $20B market (making it the biggest market in the middle-end area), and we expect it to continue growing at a 9% clip, ultimately reaching $35B by 2018!
Flip-Chip capacity (http://www.reportsnreports.com/reports/233961-flip-chip-market-and-technology-trends.html) is expected to grow over the next five years to meet large demand from three main areas:
1) CMOS 28nm IC, including new applications like APE and BB;
2) The next generation of DDR Memory;
3) 3DIC/2.5D Interposer using micro-bumping. Driven by these applications, Cu pillar is on its way to becoming interconnected of choice for Flip-Chip.
In addition to traditional applications which have used Flip-Chip for a while now (laptop, desktop and their CPUs, GPUs & Chipsets -- which are growing slowly but still represent significant production volumes for Flip-Chip), we expect to see strong demand from Mobile & Wireless (smart phones), Consumer applications (tablets, smart TV, set top box), Computing and High-Performance/Industrial applications such as network, servers, data centers and HPC.
Flip-Chip is being reshaped by a new kind of demand that is hungry for Cu pillars and micro-bumps, which are on their way to becoming the new mainstream bumping metallurgy for die interconnection.
Meanwhile Cu pillar Flip-Chip is expected to grow at a 35% CAGR during 2010 - 2018 in terms of wafer count. Production is already high at Intel, the #1 Flip-Chip producer -- and by 2014, more than 50% of bumped wafers for Flip-Chip will be equipped with Cu pillars.
As early as 2013, micro-bumping for 2.5D & 3DIC, in conjunction with new applications like APE, DDR memory, etc., will boost Flip-Chip demand and create new challenges and new technological developments (see figure below). Today, Flip-Chip is available in a wide range of pitches to answer the specific needs of every application.
The ultimate evolution in bumping technologies will consist of directly bonding IC with copper pads. 3D integration of ICs using this bump-less Cu-Cu bonding is expected to provide an IC-to-IC connection density higher than 4 x 105 cm-2, making it suitable for future wafer-level 3D integration of IC in order to augment Moore’s Law scaling.
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Taiwan: The #1 location for Flip-Chip bumping
The major OSATs are preparing to produce fcBGA-based Cu pillar packages and won't limit the reach of cu pillar bumping to fcCSP. This will allow every company involved in CPU, GPU Chipset, APE, BB, ASIC, FPGA and Memory to access Cu pillar Flip-Chip technology.
Cu pillar capacity is expected to grow rapidly over the 2010 - 2014 timeframe (31% CAGR), hitting ~ 9M wspy by 2014 and supporting the growing demand for micro-bumping and advanced CMOS IC bumping.
Key Features of the Report:
- Fully updated 2010 - 2018 market forecast and bottom-up approach, including micro-bumping for 3DIC!
- 2012 installed capacity
- Comparison between C2 and TCB
- Strong focus on micro-bumping for 3DIC & 2.5D
- Market share/data for Flip-Chip bonder
- Detailed technology roadmap
- TIM market data
- Application focus: HB-LED, CIS, micro-bumping for 3DIC and 2.5D, memory, analog, RF, mixed signals IC
- Under fill market data
- Flip-Chip substrate market data
What's new compared to last edition?
- A new top-down approach, leading to an exhaustive quantification of IC using Flip-Chip
- Micro-bumping and accurate modeling of memory and HB-LED applications
- Market data for TIM, under fills, substrates and Flip-Chip bonders
- Detailed technology roadmap.
Objectives of the Report
- Update the business status of the Flip-Chip market.
- Provide a forecast for the next five years, and predict future trends.
- Deliver an overview of the technology trends and applications which use Flip-Chip technology.
Major companies listed.
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