World Hot Melt Adhesives Market to Reach $3.9 Billion by 2012, According to New Report by Global Industry Analysts, Inc.

Share Article

Hot melt adhesives are amongst the premier emergent adhesives in the industry. The usage of hot melt adhesives continues to grow thanks to their exclusive properties that include adhesion to a broad assortment of surfaces, effortless use, aging features, and strength, among others. Backed by excellent adhesion characteristics and increasing usage in various applications, the world hot melt adhesives market is expected to reach $3.9 billion by 2012.

Hot Melt Adhesives: A Global Strategic Business Report

Currently, the world operates on a faster and tougher pace with rigid competition than before. Everyone from diaper production to packaging lines are seeking a more competent and well organized ways to manufacture and package materials and products, decrease down time, boost line speed, and reduce maintenance and power expenditure. Hot melt adhesives developed using an innovative technology of employing metallocene polyolefin catalyst, acts as a response to these requirements and in fact exceeds in satisfying them. These hot melt adhesives operate on various substrates and under the most extensive range of service temperatures. Hot melt adhesives are distinctively superior in terms of speed and cost efficiencies, and at par with water-based alternatives in terms of adhesion and VOC emissions.

Shift of consumer base to the lucrative and emerging markets such as Asia-Pacific, and Central & Eastern Europe is the major trend being witnessed in the hot melt adhesives market. However, escalating raw material prices represent a daunting challenge for hot melt adhesive market participants.

Global hot melt adhesives market is exhibiting robust growth compared to solvent-based adhesives. Hot melts are highly viscous and are preferred over solvent-based adhesives for bonding substrates that are permeable and porous in nature. North America leads the global hot melt adhesives market. However, fastest growth is likely to emanate from the developing Asia-Pacific region. Packaging application, the largest end-use segment for hot melt adhesives, is projected to retain its lead through 2015.

The global marketplace is characterized by participants such as 3M Corporation, Adhesive Technologies, Ashland, Avery Dennison Corporation, Beardow & Adams (Adhesives) Limited, Bostik, Costchem srl, Cytec Industries, Dow Corning Corporation, Dynea Oy, Evans Adhesive Corporation, H.B. Fuller Company, Henkel Adhesive Technologies, Hexcel Corporation, Hexion Specialty Chemicals, Hot Melt Technologies, Huntsman Corporation, Jowat Corporation, Rohm and Haas Company, Toyobo.

"Hot Melt Adhesives: A Global Strategic Business Report" from Global Industry Analysts, Inc. provides a comprehensive review of market trends, drivers, product profile, players, recent developments, mergers, acquisitions, and other strategic industry activities. Analysis is presented for major geographic markets such as the North America, Japan, Europe, Asia-Pacific and rest of world. Global and regional analytics are provided in terms of end-use market segments including Packaging, Non-Rigid Bonding, Woodworking and Others.

For more details about this research report, please visit

About Global Industry Analysts, Inc.
Global Industry Analysts, Inc., (GIA) is a reputed publisher of off-the-shelf market research. Founded in 1987, the company is globally recognized as one of the world's largest market research publishers. The company employs more than 700 people worldwide and publishes more than 880 full-scale research reports each year. Additionally, the company also offers a range of more than 60,000 smaller research products including company reports, market trend reports and industry reports encompassing all major industries worldwide.

Global Industry Analysts, Inc.
Telephone 408-528-9966
Fax 408-528-9977
Email press (at) StrategyR (dot) com
Web Site


Share article on social media or email:

View article via:

Pdf Print

Contact Author

Public Relations
Visit website