When customers and prospects learn of the wide array of noble metals we can process, it often leads to new discussions about the possibility of sputtering or plating other materials.
Wilmington, MA (PRWEB) June 10, 2011
Micro components maker Metrigraphics LLC has expanded its sputtering and plating capabilities by increasing the number and types of noble metals it uses in the processes.
While the Massachusetts-based company has worked with gold, nickel and chromium for some time, it has branched out into other materials, based on demand.
“We’ve had numerous inquiries about our capabilities concerning a wide variety of noble metals,” company President Randolph Sablich said. “Based on this, we first added Palladium to our sputtering capability and now Platinum to our plating area. This is truly customer driven.”
Medical device companies are seeking materials that are the least reactive with body fluids, he said. The less reactive the materials, the longer the device will perform, Sablich said.
Sputtering and plating are two techniques used to make micro-sized parts, such as neuro-stimulation devices, circuits for electrodes in active medical sensors and other thin-film circuitry applications.
The list of sputtering materials now includes:
- Chromium Nitride
- Nickel Chromium
- Nickel Vanadium
- Stainless Steel 316L
- Titanium Tungsten
Metrigraphics now plates the following with variations through additives:
- Gold Pure
- Gold Hard
- Nickel Cobalt
The capabilities expansion marks an exciting era for Metrigraphics, Sablich said.
“This opens up broader opportunities for us, particularly in biotechnology. When customers and prospects learn of the wide array of noble metals we can process, it often leads to new discussions about the possibility of sputtering or plating other materials,” he said.
Plating and sputtering are just two examples of Metrigraphics’ photolithography, thin film processing, and precision electroforming capabilities. Visit http://www.metrigraphicsllc.com for more details on the micro components manufacturing leader and its sputtering and plating operations.
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