Metrigraphics Hones Micro Interconnect Technologies

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Leading micro component maker Metrigraphics LLC has developed a technology that meets the growing need to miniaturize medical devices yet circumvents the micro interconnect problems that plague existing solutions.

Metrigraphics

Metrigraphics' ERMF™ technology can achieve design parameters such as a minimum trace and space width of less than 0.005mm.

Leading micro component maker Metrigraphics LLC has developed a technology that meets the growing need to miniaturize medical devices yet circumvents the micro interconnect problems that plague existing solutions.

The Massachusetts-based technology leader released details about its capabilities at the recent Medical Design & Manufacturing exhibition in Minneapolis.

Metrigraphics cited the need to connect bio device components at sub-miniature levels for a variety of bio-compatibility applications, including:

  • Subcutaneous use
  • Single-use, removable in-body devices
  • Short-term and long-term implants

The company’s ERMF™ technology is based on a combination of three of Metrigraphics’ core strengths:

  • Hi-resolution photolithography
  • Thin film metal deposition
  • Patterned Electroplating

Using ERMF™, Metrigraphics can achieve design parameters such as a minimum trace and space width of less than 0.005 mm, a recommended aspect ratio of less than two, and a current maximum of six conductive layers to design and build medical microcircuits with extremely fine features.

Metrigraphics is a leader in photolithography, thin film processing, and precision electroforming. Click here to view Metrigraphics’ full MD&M presentation. Or learn more about their ERMF™ capabilities by visiting their website.

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Diane Black
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