TOPSwitch®-HX Family Of Products Launched In New Compact Form Factor, Simplifies Thermal Design

SAN JOSE, Calif. (Business Wire EON/PRWEB ) March 2, 2008 -- Power Integrations (NASDAQ: POWI), the leader in high-voltage analog integrated circuits for power conversion, today announced the availability of its TOPSwitch-HX series of AC-DC power conversion ICs in the new eSIP-7C Eco-Single-Inline-Package. This package exhibits the same low thermal impedance as the traditional TO-220, yet stands less than 10mm above the PCB - half the height of the 45 year old package, and takes less board space eSIP-based designs reduce the overall height of the power supply in support of increasing market demand for slimmer electronic products such as LCD monitors, flat screen TVs and set-top boxes.

The new eSIP package removes the power device as the limiting factor in the headroom required by the power supply in the new generation of slim LCD monitors, flat screen TVs and set-top boxes. Applications such as high power adapters for a variety of products really benefit from the low profile eSIP package. More information is in the TOPSwitch-HX Data Sheet.

As with all Power Integrations products, the heatsink attached to the eSIP package is at Source potential and therefore electrically quiet without the use of an insulating pad, greatly reducing system EMI and assembly cost. In addition to thermal and physical size benefits, the new eSIP package also reduces power supply manufacturing costs. An easy-to-use, low-cost clip reduces heatsink assembly time and improves package to heatsink contact repeatability, ensuring consistently good thermal performance in contrast to the asymmetrically-mounted screw tab on the older TO-220 package design. The clip-mounted eSIP passes shock and vibration tests to IEC 60068.

In addition to offering a compact form factor, the eSIP package meets the high voltage creepage and clearance requirements through innovative design of the package and the pin layout.

Comments Andrew Smith, product marketing manager at Power Integrations: “The new eSIP package removes the power device as the limiting factor in the headroom required by the power supply in the new generation of slim LCD monitors, flat screen TVs and set-top boxes. Applications such as high power adapters for a variety of products really benefit from the low profile eSIP package. More information is in the TOPSwitch-HX Data Sheet."

About Power Integrations

Power Integrations is the leading supplier of high-voltage analog integrated circuits used in power conversion. The company's breakthrough integrated-circuit technology enables compact, energy-efficient power supplies in a wide range of electronic products, in both AC-DC and DC-DC applications. The company's EcoSmart® energy-efficiency technology, which dramatically reduces energy waste, has saved consumers and businesses around the world more than an estimated $2.7 billion on their electricity bills since its introduction in 1998. For more information, visit the company's website at www.powerint.com.

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