The CoreModule 720 is based on the PC/104-Plus stackable form factor and allows customers to build low power solutions for space constrained, extreme rugged environments.
San Jose, CA (PRWEB) December 13, 2012
ADLINK Technology, Inc., a leading global provider of ruggedized embedded products, today announced that EDN has named the CoreModule® 720 PC/104-Plus single board computer (SBC) as one of the “100 Hot Products of 2012.” The 2012 EDN Hot 100 highlights the electronics industry’s most significant products of the year based on innovation, significance, usefulness, and popularity.
“It’s gratifying to have our product recognized by a well-regarded third-party such as EDN,” said Jeff Munch, CTO of ADLINK Technology. “As a standards-leader, ADLINK strives to raise the bar for rugged design so that our customers are able to create ever more innovative applications using compact form factor technology.”
The Ampro by ADLINK™ Extreme Rugged™ CoreModule 720 is based on the Intel® Atom™ Processor E600T series from 600 MHz up to 1.6 GHz. The PC/104-Plus stackable form factor allows customers to build low power solutions for space constrained, extreme rugged environments. The SBC offers PCI and ISA bus connectivity, an integrated 4GB SSD, CAN bus, SATA, and a broad range of peripheral I/O support. Designed to meet stringent shock and vibration requirements, the CoreModule 720 uses 50% thicker printed circuit board (PCB) and supports an extended temperature range of -40°C to +85°C.
“It's always a fun and enlightening challenge for the EDN editors to select the year's Hot 100 products, which has been an annual tradition at EDN since 1993. This year's selection not only reflects some technology trends that have been in place for a while, but also highlights some new trends that are just emerging, as well as a unique product or two that is in a class of its own,” said Rich Pell, executive and chief technical editor, EDN.
The complete list of EDN’s Hot 100 products can be found online at http://www.edn.com/electronics-products/other/4401457/EDN-Hot-100-products-of-2012 or within tomorrow’s issue of EDN Magazine.
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and computer-on-modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc. and LiPPERT Embedded Computers GmbH, ADLINK also provides a wide range of Rugged by Design products, including single board computers, computer-on-modules and systems.
ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices.
ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified, is an Associate Member of the Intel® Intelligent System Alliance, an Executive Member of PICMG, a Sponsor Member of the PXI Systems Alliance, and a Strategic Member of the AXIe Consortium. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).
About UBM Tech
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Ampro by ADLINK, ADLINK Extreme Rugged, and ADLINK CoreModule are registered trademarks of ADLINK Technology. Intel and Core are registered trademarks of Intel® Corporation in the United States and other countries. All other trademarks are property of their respective owners.